Inventor

Takaharu Mae

Inventor

Hirakata, JP

Overview

1988–2011

Patent span

Electricity

Primary field (CPC H)

Patents· 21 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%

B23KSoldering or unsoldering12%

Y10TTechnical subjects covered by former us classification10%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

H05KPrinted circuits4%

G06TImage data processing or generation, in general2%

Y02PClimate change mitigation technologies in the production or processing of goods2%

PatentTitleYear

7,861,908'Component mounting method, component mounting apparatus, and ultrasonic bonding head'2011 7,516,878'Bump formation method and bump forming apparatus for semiconductor wafer'2009 7,387,229'Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore'2008 7,350,684'Apparatus and method for forming bump'2008 7,296,727'Apparatus and method for mounting electronic components'2007 7,229,854'Electronic component mounting method and apparatus and ultrasonic bonding head'2007 7,052,984'Bump formation method and bump forming apparatus for semiconductor wafer'2006 7,031,509'Method and apparatus for correcting inclination of IC on semiconductor wafer'2006 7,014,092'Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate'2006 7,005,368'BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVAL METHOD FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVING UNIT FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, AND CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE'2006 6,910,613'Device and method for forming bump'2005 6,818,975'ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE'2004 6,787,391'Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor'2004 6,619,535'Working method for holding a work object by suction'2003 6,568,580'Bump bonding apparatus and method'2003 6,494,358'Bump bonding apparatus and method'2002 6,392,202'Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer'2002 6,329,640'Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer'2001 6,302,317'Bump bonding apparatus and method'2001 6,098,868'Bump forming method and bump bonder'2000 4,763,811'Parts feeder'1988

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (19)· patent assignee history

1988Based in Kofu, JP· patent location history

2000–2011Based in Hirakata, JP· patent location history

2001–2002Based in Osaka, JP· patent location history

2009–2011Patents assigned to PANASONIC CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD	19	1988–2008
PANASONIC CORP	2	2009–2011

Locations

Location	Patents	Span
Hirakata, JP	18	2000–2011
Osaka, JP	2	2001–2002
Kofu, JP	1	1988