Inventor
WEI-YANG LEE
Inventor
TW
Overview
Patents· 146 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices29%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
B82YSpecific uses or applications of nanostructures15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10BElectronic memory devices2%
G06FElectric digital data processing0%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes0%
G16HHealthcare informatics, i.e. information and communication technology [ict] specially adapted for the handling or processing of medical or healthcare data0%
H04LTransmission of digital information, e.g. telegraphic communication0%
PatentTitleYear
12,588,283Semiconductor structure and related methods202612,581,691Methods of manufacturing semiconductor devices and semiconductor devices202612,568,648Backside source/drain contacts and methods of forming the same202612,543,361Gate-all-around transistor having inner space lined by a semiconductor liner and method of forming the same202612,538,532Method of forming a gap under a source/drain feature of a multi-gate device202612,532,532Epitaxial features in semiconductor devices and method of manufacturing202612,527,039Semiconductor devices with enhanced carrier mobility202612,520,555Inner spacer for a multi-gate device and related methods202612,520,560Selective gate air spacer formation202612,520,526Semiconductor devices with modified source/drain feature and methods thereof202612,507,446—202512,501,601Method for forming different types of devices202512,471,306Semiconductor device active region profile and method of forming the same202512,464,769Semiconductor device with epitaxial bridge feature and methods of forming the same202512,457,770Source and drain engineering process for multigate devices202512,453,127Methods of manufacturing semiconductor devices and semiconductor devices202512,453,161Semiconductor device with air-spacer202512,439,651Integrated circuit structure202512,433,008FinFET structure with airgap and method of forming the same202512,432,990Epitaxial source/drain feature with enlarged lower section interfacing with backside via202512,426,297Method and structure for air gap inner spacer in gate-all-around devices202512,426,346Semiconductor device and method202512,408,377Semiconductor device structure with backside contact202512,402,364Semiconductor device structure and method for forming the same202512,402,354Epitaxial features in semiconductor devices and manufacturing method of the same202512,396,220Isolation structures in multi-gate field-effect transistors202512,382,660Structure and formation method of semiconductor device with embedded epitaxial structure202512,382,703Spacer features for nanosheet-based devices202512,382,692Dielectric inner spacers in multi-gate field-effect transistors202512,369,334Method of manufacturing a semiconductor device and a semiconductor device202512,369,383Semiconductor structure with gate-all-around devices and stacked FinFET devices202512,363,988Inner spacer features for multi-gate transistors202512,363,989Semiconductor device with leakage current suppression and method for forming the same202512,363,950Nano-FET semiconductor device and method of forming202512,356,662Asymmetric source/drain for backside source contact202512,349,393Semiconductor device transistor having multiple channels with different widths and materials202512,324,201Integrated circuit device with source/drain barrier202512,317,552Semiconductor device structure and method for forming the same202512,317,556Semiconductor devices and methods of manufacture202512,310,057Semiconductor devices including backside vias and methods of forming the same202512,308,287Integrated circuit structure with backside dielectric layer having air gap202512,302,615Epitaxial structures exposed in airgaps for semiconductor devices202512,278,145Semiconductor devices with a source/drain barrier layer and methods of manufacture202512,272,729Asymmetric source/drain for backside source contact202512,268,023Devices with improved operational current and reduced leakage current202512,266,655Transistors with recessed silicon cap and method forming same202512,266,576Semiconductor device and methods of manufacture202512,237,390Low resistance contact feature202512,237,399Nano-FET transistor with alternating nanostructures and method of forming thereof202512,237,230Semiconductor device with leakage current suppression and method for forming the same202512,237,403Structure of a fin field effect transistor (FinFET) comprising epitaxial structures202512,237,232Methods for forming source/drain features202512,218,138Air gap formation between gate spacer and epitaxy structure202512,211,749Cut EPI process and structures202512,191,369Source and drain engineering process for multigate devices202512,191,370Semiconductor device with tunable channel layer usage and methods of fabrication thereof202512,176,400Backside contact with air spacer202412,154,947Methods of forming epitaxial source/drain features in semiconductor devices202412,142,647Self-aligning backside contact process and devices thereof202412,136,658Integrated circuit with doped low-k sidewall spacers for gate stacks202412,125,889Source/drain contact with low-k contact etch stop layer and method of fabricating thereof202412,107,165Semiconductor device structure with cap layer202412,087,837Semiconductor device with backside contact and methods of forming such202412,080,775Semiconductor device and forming method thereof202412,080,800Semiconductor devices with modified source/drain feature and methods thereof202412,068,204Methods of forming epitaxial structures in fin-like field effect transistors202412,068,371Method for FinFET LDD doping202412,068,389Semiconductor device including gas spacers and method of manufacture202412,062,692Tapered dielectric layer for preventing electrical shorting between gate and back side via202412,051,732Semiconductor structure and method for forming the same202412,051,628Semiconductor device with funnel shape spacer and methods of forming the same202412,040,407Semiconductor devices including backside vias and methods of forming the same202412,034,048Source/drain features202412,027,626Semiconductor device active region profile and method of forming the same202412,021,133Inner spacer liner202412,015,060Structure and formation method of semiconductor device with backside contact202412,002,845Method of manufacturing a semiconductor device and a semiconductor device202411,996,467Method for epitaxial growth and device202411,984,489Air spacer for a gate structure of a transistor202411,973,122Nano-FET semiconductor device and method of forming202411,949,002Semiconductor device and method202411,935,781Integrated circuit structure with backside dielectric layer having air gap202411,923,409Epitaxial structures exposed in airgaps for semiconductor devices202411,917,803Method for forming different types of devices202411,916,110Semiconductor device having nanosheet transistor and methods of fabrication thereof202411,908,748Semiconductor devices and methods of forming the same202411,901,236Semiconductor structure with gate-all-around devices and stacked FinFET devices202411,901,410Semiconductor devices and methods of manufacture202411,894,421Integrated circuit device with source/drain barrier202411,854,688Semiconductor device and method202311,855,167Structure and formation method of semiconductor device with nanosheet structure202311,855,220Method and structure for air gap inner spacer in gate-all-around devices202311,855,225Semiconductor device with epitaxial bridge feature and methods of forming the same202311,855,097Air gap formation between gate spacer and epitaxy structure202311,830,922Semiconductor device with air-spacer202311,810,825Methods of forming epitaxial structures in fin-like field effect transistors202311,799,002Semiconductor devices and methods of forming the same202311,798,996Backside contact with air spacer202311,769,820Methods of manufacturing a FinFET by forming a hollow area in the epitaxial source/drain region202311,749,719Source/drain features202311,735,641FinFET structure with airgap and method of forming the same202311,735,660Method of forming semiconductor device202311,728,344Hybrid SRAM design with nano-structures202311,728,223Semiconductor device and methods of manufacture202311,710,792Semiconductor structure with improved source drain epitaxy202311,699,737Integrated circuit with doped low-k side wall spacers for gate spacers202311,694,933Methods of forming metal gate spacer202311,688,793Integrated circuit structure and manufacturing method thereof202311,688,794Method for epitaxial growth and device202311,677,028PMOS FinFET202311,631,736Epitaxial source/drain feature with enlarged lower section interfacing with backside via202311,631,746Semiconductor device and method of manufacture202311,626,505Dielectric inner spacers in multi-gate field-effect transistors202311,626,508Structure of a fin field effect transistor (FinFET)202311,575,047Semiconductor device active region profile and method of forming the same202311,569,386Method for forming semiconductor device structure with cap layer202311,532,749Semiconductor structure with blocking layer202211,515,211Cut EPI process and structures202211,508,827Air spacer for a gate structure of a transistor202211,508,736Method for forming different types of devices202211,502,182Selective gate air spacer formation202211,502,005Semiconductor devices and methods of forming the same202211,495,606FinFET having non-merging epitaxially grown source/drains202211,488,874Semiconductor device with funnel shape spacer and methods of forming the same202211,456,295Air gap formation between gate spacer and epitaxy structure202211,450,559Integrated circuit structure with backside dielectric layer having air gap202211,444,178Inner spacer liner202211,444,162Backside contact with air spacer202211,417,767Semiconductor devices including backside vias and methods of forming the same202211,398,553Source/drain features202211,387,322Semiconductor device having nanosheet transistor and methods of fabrication thereof202211,374,128Method and structure for air gap inner spacer in gate-all-around devices202211,362,199Semiconductor device and method202211,355,400Using a metal-containing layer as an etching stop layer and to pattern source/drain regions of a FinFET202211,328,960Semiconductor structure with gate-all-around devices and stacked FinFET devices202211,296,077Transistors with recessed silicon cap and method forming same202211,289,574Methods of forming epitaxial source/drain features in semiconductor devices202211,257,928Method for epitaxial growth and device202211,217,490Source/drain features with an etch stop layer202211,217,486Semiconductor device and method202211,211,455Formation of dislocations in source and drain regions of FinFET devices202111,205,597Semiconductor device and method202111,201,228Semiconductor device with air-spacer202111,189,705Methods of reducing parasitic capacitance in multi-gate field-effect transistors202111,189,706FinFET structure with airgap and method of forming the same202111,152,486FinFET semiconductor device having source/drain contact(s) separated by airgap spacer(s) from the gate stack(s) to reduce parasitic capacitance2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (146)· patent assignee history
2021–2026Based in TW· patent location history
2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD V (1)· patent assignee history
2024Patents assigned to TAIWAN SEMINCODCUTOR MFG COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 146 | 2021–2026 |
| TAIWAN SEMICONDUCTOR MFG CO LTD V | 1 | 2024 |
| TAIWAN SEMINCODCUTOR MFG COMPANY LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 146 | 2021–2026 |