Inventor
Mitsuo Miyamoto
Inventor
Hadano, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Bprimary
B23BTurning10%
B25DPercussive tools10%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges10%
H05KPrinted circuits10%
Y10TTechnical subjects covered by former us classification10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
A01NPreservation of bodies of humans or animals or plants or parts thereof5%
C02FTreatment of water, waste water, sewage, or sludge5%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%
LOC145%
PatentTitleYear
9,885,201'Lock device for linear motion rod'2018D0627376'Stopper cylinder'20107,484,615'Stopper cylinder'20096,751,851'Fastening structure using a taper implant'20046,609,288'Taper implant and a screw-fastening structure using a taper implant with female threads'20036,591,475'Method for fixing a taper implant to a receiving member'20036,488,458'Taper implant and a screw-fastening structure using a taper implant with female threads'20026,285,546'Mounting structure for electronic device'2001D0444148'Computer housing'2001D0427191'Computer housing'20005,558,493'Forced air cooling apparatus having blower and air current regulating plate that reduces eddy air current at inlet of blower'19965,345,107'Cooling apparatus for electronic device'19945,282,967'Method for feeding germ-free pure water'19945,147,605'Method for the sterilization of ultrapure water line'19925,144,531'Electronic apparatus cooling system'19925,109,317'Mounting mechanism for mounting heat sink on multi-chip module'19925,040,992'Mounting structure for electronic device'1991D0307420'Central processor unit'19904,837,663'Electronic apparatus cooling system'19894,739,444'Device for adjusting pressure loss of cooling air for an assembly of cards carrying electronic components'19884,579,605'Flux for brazing the aluminum parts and preparing method of the same'1986D0278712'Central processor unit'1985Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1985–2004Patents assigned to HITACHI LTD (16)· patent assignee history
1985–1990Based in Hatano, JP· patent location history
1986–1994Patents assigned to MORITA KAGAKU KOGYO (3)· patent assignee history
1986Patents assigned to FURUKUWA ALUMINUM CO LTD (1)· patent assignee history
1988–2004Based in Hadano, JP· patent location history
1992–1994Based in Osaka, JP· patent location history
2001Patents assigned to HITACHI INFORMATION TECHNOLOGY (1)· patent assignee history
2009–2018Based in Toride, JP· patent location history
2010–2018Patents assigned to SMC CORP (2)· patent assignee history
2010Based in Tsukubamirai, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 16 | 1985–2004 |
| MORITA KAGAKU KOGYO | 3 | 1986–1994 |
| SMC CORP | 2 | 2010–2018 |
| FURUKUWA ALUMINUM CO LTD | 1 | 1986 |
| HITACHI INFORMATION TECHNOLOGY | 1 | 2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hadano, JP | 13 | 1988–2004 |
| Toride, JP | 2 | 2009–2018 |
| Osaka, JP | 2 | 1992–1994 |
| Hatano, JP | 2 | 1985–1990 |
| Tsukubamirai, JP | 1 | 2010 |