Inventor
Akira Hamanaka
Inventor
Tokyo, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics17%
B29DProducing particular articles from plastics or from substances in a plastic state17%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests17%
Y10TTechnical subjects covered by former us classification17%
B24BMachines, devices, or processes for grinding or polishing11%
B29LIndexing scheme associated with subclass b29c, relating to particular articles6%
G02BOptical elements, systems or apparatus6%
H01JElectric discharge tubes or discharge lamps6%
Y02PClimate change mitigation technologies in the production or processing of goods6%
PatentTitleYear
8,440,041'Lens pad, lens pad manufacturing method, lens manufacturing method, and adhesive member'20138,216,024'Spectacle lens edging method'20127,919,020'Method of manufacturing plastic lens, gasket for molding plastic lens, casting mold for molding plastic lens, casting jig for plastic lens starting material liquid, holding member for plastic lens casting mold, and plastic lens manufacturing apparatus'20117,694,404'Method for assembling mold for forming plastic lens'20107,344,370'Device and method for assembling mold for forming plastic lens'20084,720,748'Cathode ray tube'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988Patents assigned to SONY CORP (1)· patent assignee history
1988Based in Setagaya, JP· patent location history
2008–2013Patents assigned to HOYA CORP (5)· patent assignee history
2008–2013Based in Tokyo, JP· patent location history
2012–2013Patents assigned to HAMANAKA AKIRA (2)· patent assignee history
2012Patents assigned to DAIMARU TAKASHI (1)· patent assignee history
2013Patents assigned to SAGAMI DAIJI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HOYA CORP | 5 | 2008–2013 |
| HAMANAKA AKIRAself | 2 | 2012–2013 |
| DAIMARU TAKASHI | 1 | 2012 |
| SAGAMI DAIJI | 1 | 2013 |
| SONY CORP | 1 | 1988 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 5 | 2008–2013 |
| Setagaya, JP | 1 | 1988 |