Inventor

Pratik Pravinkumar SHAH

Inventor

Overview

2→

Patents

2021–2022

Patent span

Performing operations

Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B33Yprimary

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering40%

G03GElectrography40%

B29CShaping or joining of plastics20%

PatentTitleYear

11,269,267Contact pads on an output assembly of a print particle replenishment device including an interior disk and a cover disk2022 11,175,607Print particle output assembly2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2022Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history

2021–2022Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HEWLETT PACKARD DEVELOPMENT CO	2	2021–2022

Locations

Location	Patents	Span
US	2	2021–2022