Inventor
Koichi Ikeda
Inventor
Kanagawa, JP
Overview
Patents· 49 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
H01PWaveguides5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems4%
H01HElectric switches4%
H05KPrinted circuits4%
C08LCompositions of macromolecular compounds3%
C09JAdhesives3%
PatentTitleYear
10,457,543Electrostatic actuator and switch20199,748,707'Signal transmission cable'20179,362,683'Signal transmission cable'20169,243,811'Predicted mean vote estimating device and computer program product'20169,059,492'Waveguide interposer substrate having first and second conversion structures on opposed waveguide surfaces'20159,025,279'Pressure-sensitive adhesive sheet and magnetic disk drive'20158,952,856'Transmission/reception element for switching radiation frequency'20158,704,116'Lateral motion micro-electro-mechanical system contact switch'20148,673,443'Pressure-sensitive adhesive tape or sheet having light-reflective property and/or light-shielding property, and liquid crystal display apparatus'20148,647,730'Hydrogenated norbornene-based ring-opening polymerization polymer, resin composition, and molded object'20148,615,327'Device and method for humidity estimation'20138,610,520'Electrostatically actuated micro-mechanical switching device'20138,586,160'Hydrogenated norbornene-based ring-opening polymerization polymer, resin composition, and molded object'20138,546,911'High frequency device'20138,498,748'Air conditioning control system'20138,481,166'Hydrogenated norbornene-based ring-opening polymerization polymer, resin composition, and molded object'20138,456,037'Shunt switch, semiconductor device, module and electronic device'20138,452,892'Scheduling apparatus and method'20138,432,316'High frequency device'20138,153,250'Double-faced pressure-sensitive adhesive tape'20128,093,988'Entry control system and entry control method'20128,075,970'Heat-activated adhesive sheet'20117,875,940'Micromachine and production method thereof'20117,728,682'Micro-oscillator, semiconductor device and communication apparatus'20107,614,145'Method for manufacturing multilayer circuit board and resin base material'20097,566,956'Semiconductor composite device and method of manufacturing the same'20097,402,877'Micromachine and method of manufacturing the micromachine'20087,396,588'Curable composition, varnish and laminate'20087,312,265'Acrylic pressure sensitive adhesive composition and pressure sensitive adhesive tape'20077,178,613'Vehicle operating apparatus'20077,160,609'Curable composition, varnish, and layered product'20077,116,462'Electrostatic drive type MEMS device and manufacturing method thereof, optical MEMS device, light modulation device, GLV device, and laser display'20067,016,099'MEMS element, GLV device, and laser display'20066,946,315'Manufacturing methods of MEMS device'20056,838,304'MEMS element manufacturing method'20056,777,321'Method of forming buried wiring'20046,760,146'Light modulation element, GLV device, and laser display'20046,692,592'Method for manufacturing high chromium system seamless steel pipe'20046,524,429'Method of forming buried wiring, and apparatus for processing substratum'20036,407,011'Low dielectric constant insulating films with laminated carbon-containing silicon oxide and organic layers'20026,383,907'Process for fabricating a semiconductor device'20025,748,873'Fault recovering system provided in highly reliable computer system having duplicated processors'19985,732,363'Solidifying material for radioactive wastes, process for solidifying radioactive wastes and solidified product'19985,080,927'Tin thin film formation method'19924,779,232'Partial write control apparatus'19884,695,947'Virtual address system having fixed common bus cycles'19874,478,134'Swash plate type hydraulic device'19844,350,523'Porous iron ore pellets'19823,979,246'Heat-insulated exhaust pipe'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2013Based in Atsugi, JP· patent location history
1992–2019Based in Kanagawa, JP· patent location history
2002–2019Patents assigned to SONY CORP (22)· patent assignee history
2007–2014Patents assigned to ZEON CORP (6)· patent assignee history
2007–2015Patents assigned to NITTO DENKO CORP (5)· patent assignee history
2007–2014Based in Ibaraki, JP· patent location history
2007–2008Based in Kawasaki, JP· patent location history
2009–2014Based in Tokyo, JP· patent location history
2011–2016Patents assigned to IKEDA KOICHI (17)· patent assignee history
2013–2015Patents assigned to AKIBA AKIRA (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 22 | 2002–2019 |
| IKEDA KOICHIself | 17 | 2011–2016 |
| ZEON CORP | 6 | 2007–2014 |
| AKIBA AKIRA | 5 | 2013–2015 |
| NITTO DENKO CORP | 5 | 2007–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 27 | 1992–2019 |
| Ibaraki, JP | 4 | 2007–2014 |
| Tokyo, JP | 4 | 2009–2014 |
| Atsugi, JP | 2 | 1987–2013 |
| Kawasaki, JP | 2 | 2007–2008 |