Inventor

Masaaki Taniguchi

Inventor

Fukui, JP

Overview

57→

Patents

1981–2017

Patent span

Electricity

Primary field (CPC H)

Patents· 57 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Gprimary

H01GCapacitors30%

H05KPrinted circuits19%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%

Y10TTechnical subjects covered by former us classification5%

G06TImage data processing or generation, in general2%

H01CResistors2%

H04NPictorial communication, e.g. television2%

Y02PClimate change mitigation technologies in the production or processing of goods2%

B60LPropulsion of electrically-propelled vehicles2%

C04BLime, magnesia2%

PatentTitleYear

9,847,173Mounting substrate2017 9,646,767'Ceramic electronic component and ceramic electronic apparatus including a split inner electrode'2017 9,142,351'Electronic component and mounting structure for the electronic component'2015 8,185,908'Dynamic scheduling in a distributed environment'2012 7,936,554'Monolithic ceramic capacitor'2011 7,894,202'Multilayer capacitor'2011 7,808,770'Monolithic ceramic capacitor'2010 7,723,025'Method for evaluating quality of beef such as taste and texture on the basis of genotype of stearoyl-CoA desaturase'2010 7,526,099'Motion picture data processing device, method, and program'2009 7,430,107'Monolithic capacitor, circuit board, and circuit module'2008 7,316,755'Method of producing multi-terminal type laminated ceramic electronic component'2008 7,215,531'Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board'2007 7,065,227'Data processing apparatus, image processing apparatus, and method therefor'2006 7,006,655'Methods, apparatus and systems for an electronic watermark having resistance to scaling'2006 6,909,593'Multi-layer capacitor, wiring board, and high-frequency circuit'2005 6,795,294'Laminated capacitor, printed circuit board, decoupling circuit, and high-frequency circuit'2004 6,794,956'Circuit substrate having resistive films connecting external terminals in series with lands'2004 6,771,484'Multi-layer capacitor, wiring board, and high-frequency circuit'2004 6,721,153'Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board'2004 6,678,145'Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board'2004 6,606,237'Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same'2003 6,594,136'Multi-layer capacitor, wiring board, and high-frequency circuit'2003 6,577,491'Capacitor array'2003 6,556,420'Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board'2003 6,549,395'Multilayer capacitor'2003 6,496,354'Multilayer capacitor'2002 6,462,932'Multilayer Capacitor'2002 6,430,025'Multilayer capacitor'2002 6,407,904'Multi-layer capacitor'2002 6,370,010'Multi-layer capacitor, wiring board, and high-frequency circuit'2002 6,370,011'Multilayer capacitor'2002 6,351,369'Multi-layer capacitor, wiring substrate, decoupling circuit, and high-frequency circuit'2002 6,344,961'Multi-layer capacitator, wiring substrate, decoupling circuit, and high-frequency circuit'2002 6,327,134'Multi-layer capacitor, wiring board, and high-frequency circuit'2001 6,292,350'Multilayer capacitor'2001 6,266,229'Multilayer capacitor'2001 6,266,228'Multilayer capacitor'2001 6,226,169'Multilayer capacitor'2001 6,215,647'Multilayer capacitor'2001 6,191,932'Monolithic capacitor'2001 6,188,565'Multilayer capacitor'2001 6,104,160'Household power supply system using electric vehicle'2000 6,072,687'Multilayer capacitor'2000 6,038,121'Monolithic capacitor'2000 6,034,864'Multilayer capacitor'2000 5,994,995'Laminated chip varistor and production method thereof'1999 5,692,280'Manufacturing method of laminated ceramic electronic components'1997 5,680,884'Rectifying device'1997 5,644,840'Method of producing a plate-type heat exchanger'1997 5,440,794'Method of manufacturing laminated ceramic capacitors'1995 5,429,183'Plate-type heat exchanger and method of producing the same'1995 5,337,038'PTC thermistor'1994 5,029,234'System and method for communicating a vehicle with a calling party'1991 4,920,915'Work holder for masking'1990 4,671,917'Method and apparatus for cooling molten oxides'1987 4,409,949'Exhaust gas recirculation control means for multiple cylinder engine having means for controlling air-fuel ratio in accordance with a signal from an exhaust gas sensor'1983 4,300,666'Current collecting means in an aerial cableway system'1981

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1981–2000Patents assigned to NISSAN MOTOR (3)· patent assignee history

1990–2017Patents assigned to MURATA MANUFACTURING CO (41)· patent assignee history

1991–2009Based in Kanagawa, JP· patent location history

1994–1999Patents assigned to TDK CORP (2)· patent assignee history

1995–1997Patents assigned to MITSUBISHI ELECTRIC CORP (2)· patent assignee history

1995–2017Based in Nagaokakyo, JP· patent location history

1997–2011Based in Fukui, JP· patent location history

2000–2011Based in Nishikamo-gun, JP· patent location history

2006–2012Patents assigned to IBM (4)· patent assignee history

2006–2012Based in Yamato, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MURATA MANUFACTURING CO	41	1990–2017
IBM	4	2006–2012
NISSAN MOTOR	3	1981–2000
MITSUBISHI ELECTRIC CORP	2	1995–1997
TDK CORP	2	1994–1999

Locations

Location	Patents	Span
Fukui, JP	34	1997–2011
Nagaokakyo, JP	4	1995–2017
Yamato, JP	3	2006–2012
Nishikamo-gun, JP	3	2000–2011
Kanagawa, JP	3	1991–2009