Inventor

Masaya Nishiyama

Inventor

Tokyo, JP

Overview

2004–2021

Patent span

Chemistry

Primary field (CPC C)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%

C09GPolishing compositions13%

C09KMaterials for miscellaneous applications, not provided for elsewhere13%

B24BMachines, devices, or processes for grinding or polishing9%

H01LSemiconductor devices9%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%

B24DTools for grinding, buffing or sharpening3%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%

C01FCompounds of the metals beryllium, magnesium, aluminium, calcium, strontium, barium, radium, thorium, or of the rare-earth metals3%

C01GCompounds containing metals not covered by subclasses c01d or c01f3%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2004–2021Patents assigned to HITACHI CHEMICAL CO LTD (6)· patent assignee history

2004–2006Based in Tsukuba, JP· patent location history

2008–2016Based in Hitachi, JP· patent location history

2018–2021Based in Tokyo, JP· patent location history

2021Patents assigned to SHOWA DENKO MATERIALS CO LTD (1)· patent assignee history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI CHEMICAL CO LTD	6	2004–2021
SHOWA DENKO MATERIALS CO LTD	1	2021

Locations