Inventor
Bao-Chun Chen
Inventor
Shenzhen, CN
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1070%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact10%
G06FElectric digital data processing10%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
7,866,375'Heat dissipation device with heat pipes'20117,310,229'Heat dissipating device'20077,286,363'Heat dissipation device'20077,286,357'Computer system with cooling device for CPU'20077,283,361'Heat dissipation device'20077,190,588'Heat-dissipating fin assembly for heat sink'20077,142,430'Heat dissipating device assembly'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2011Patents assigned to FOXCONN TECH CO LTD (7)· patent assignee history
2006–2011Based in Shenzhen, CN· patent location history
2007Patents assigned to FU ZHUN PREC INDUSTRY SHENZHEN (1)· patent assignee history
2007Based in Guangdong, CN· patent location history
2011Patents assigned to FU ZHUN PRECISION IND SHENZHEN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FOXCONN TECH CO LTD | 7 | 2006–2011 |
| FU ZHUN PREC INDUSTRY SHENZHEN | 1 | 2007 |
| FU ZHUN PRECISION IND SHENZHEN | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shenzhen, CN | 6 | 2006–2011 |
| Guangdong, CN | 1 | 2007 |