Inventor
YUNG WOO LEE
Inventor
KR
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
PatentTitleYear
12,187,603Semiconductor package using a polymer substrate202512,057,434Semiconductor package and manufacturing method thereof202412,009,289Semiconductor package and manufacturing method thereof202411,572,269Semiconductor package using a polymer substrate202311,488,934Semiconductor package and manufacturing method thereof202211,152,296Semiconductor package and manufacturing method thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (6)· patent assignee history
2021Patents assigned to AMKOR TECHNOLOGY INC (1)· patent assignee history
2021–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 6 | 2021–2025 |
| AMKOR TECHNOLOGY INC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 6 | 2021–2025 |