Inventor

Kevin K. Lin

Inventor
San Ramon, CA, US

Overview

23→
Patents
2002–2021
Patent span
Physics
Primary field (CPC G)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G11Bprimary
G11BInformation storage based on relative movement between record carrier and transducer35%
Y10TTechnical subjects covered by former us classification23%
H03HImpedance networks, e.g. resonant circuits9%
B82YSpecific uses or applications of nanostructures7%
H04LTransmission of digital information, e.g. telegraphic communication7%
C25DProcesses for the electrolytic or electrophoretic production of coatings5%
H01FMagnets5%
B01DSeparation2%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry2%
C12NMicroorganisms or enzymes2%
PatentTitleYear
10,907,145Chemotherapeutic drug-conjugated resins and their preferential binding of methylated DNA20219,349,390'Ultra-short yoke length writer'20169,282,057'Flexible stacking port'20169,282,058'Flexible stacking port'20169,117,464'Methods for manufacturing hybrid coils for magnetic write heads used in storage systems'20158,797,684'Magnetic writer configured for high data rate recording'20148,786,983'Magnetic writer having a low aspect ratio two layer coil'20148,720,044'Method for manufacturing a magnetic recording transducer having side shields'20148,514,517'Systems and methods for providing hybrid coils for magnetic write heads'20138,488,272'Magnetic recording transducer having side shields'20138,307,540'Method for providing an energy assisted magnetic recording (EAMR) transducer'20128,166,631'Method for fabricating a magnetic recording transducer having side shields'20128,090,901'TCAM management approach that minimize movements'20127,635,636'Wafer level packaging of materials with different coefficients of thermal expansion'20097,596,849'Method of assembling a wafer-level package filter'20097,230,512'Wafer-level surface acoustic wave filter package with temperature-compensating characteristics'20077,192,662'Ultra high saturation moment soft magnetic thin film'20077,111,386'Lead plating method for GMR head manufacture'20067,109,635'Wafer level packaging of materials with different coefficients of thermal expansion'20066,973,712'Lead plating method for GMR head manufacture'20056,859,997'Method for manufacturing a magnetic write element'20056,776,891'Method of manufacturing an ultra high saturation moment soft magnetic thin film'20046,496,334'Data storage and retrieval apparatus with thin film read head having planarized extra gap and shield layers and method of fabrication thereof'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2016Based in San Ramon, CA, US· patent location history
2004–2007Patents assigned to HEADWAY TECHNOLOGIES INC (4)· patent assignee history
2006–2009Based in Apopka, FL, US· patent location history
2009Based in Fremont, CA, US· patent location history
2012–2016Patents assigned to WESTERN DIGITAL FREMONT LLC (9)· patent assignee history
2012–2014Patents assigned to LIN KEVIN K (6)· patent assignee history
2012–2014Patents assigned to TRAN UT (6)· patent assignee history
2012–2014Patents assigned to BAI ZHIGANG (5)· patent assignee history
2012–2016Based in Saratoga, CA, US· patent location history
2021Based in Gilbert, AZ, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
WESTERN DIGITAL FREMONT LLC92012–2016
LIN KEVIN Kself62012–2014
TRAN UT62012–2014
BAI ZHIGANG52012–2014
HEADWAY TECHNOLOGIES INC42004–2007
Locations
LocationPatentsSpan
San Ramon, California, US152002–2016
Saratoga, California, US32012–2016
Apopka, Florida, US22006–2009
Gilbert, AZ, US12021
Fremont, California, US12009