Inventor
STEVEN VERHAVERBEKE
Inventor
US
Overview
Patents· 39 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H05KPrinted circuits9%
H01QAntennas, i.e. radio aerials6%
H10DInorganic electric semiconductor devices6%
B23KSoldering or unsoldering4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
B29CShaping or joining of plastics1%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts1%
PatentTitleYear
12,518,986Laser ablation system for package fabrication202612,482,736Semiconductor device packages202512,388,049High connectivity device stacking202512,374,611Package core assembly and fabrication methods202512,358,073Method and apparatus for laser drilling blind vias202512,354,968Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202512,087,679Package core assembly and fabrication methods202411,931,855Planarization methods for packaging substrates202411,927,885Fluoropolymer stamp fabrication method202411,887,934Package structure and fabrication methods202411,881,447Package core assembly and fabrication methods202411,862,546Package core assembly and fabrication methods202411,837,680Substrate structuring methods202311,798,903Methods of forming microvias with reduced diameter202311,742,330High connectivity device stacking202311,715,700Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202311,705,365Methods of micro-via formation for advanced packaging202311,694,912High pressure and high temperature anneal chamber202311,676,832Laser ablation system for package fabrication202311,566,322Shadow mask with plasma resistant coating202311,521,937Package structures with built-in EMI shielding202211,521,935Package structure and fabrication methods202211,476,202Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202211,469,113High pressure and high temperature anneal chamber202211,462,417High pressure and high temperature anneal chamber202211,454,884Fluoropolymer stamp fabrication method202211,424,137Drying process for high aspect ratio features202211,400,545Laser ablation for package fabrication202211,398,433Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202211,388,822Methods for improved polymer-copper adhesion202211,362,235Substrate structuring methods202211,342,256Method of fine redistribution interconnect formation for advanced packaging applications202211,315,890Methods of forming microvias with reduced diameter202211,281,094Method for via formation by micro-imprinting202211,264,333Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration202211,264,331Package structure and fabrication methods202211,257,790High connectivity device stacking202211,232,951Method and apparatus for laser drilling blind vias202211,177,128Apparatus and methods for manufacturing semiconductor structures using protective barrier layer2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to APPLIED MATERIALS INC (39)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 39 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 39 | 2021–2026 |