Inventor
SHU-WEI LI
Inventor
TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices45%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
12,525,538Semiconductor device structure and methods of forming the same202612,500,173Interconnect structure with hybrid barrier layer202512,417,981Semiconductor device including graphene interconnect and method of making the semiconductor device202512,300,599Method for forming semiconductor structure202512,211,740Interconnect structure and methods of forming the same202512,068,254Interconnection structure and methods of forming the same202412,068,253Semiconductor structure with two-dimensional conductive structures202412,062,612Semiconductor device structure and methods of forming the same202412,051,645Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability202411,948,837Semiconductor structure having vertical conductive graphene and method for forming the same202411,682,620Graded metallic liner for metal interconnect structures and methods for forming the same202311,682,616Semiconductor structure and method for forming the same202311,670,595Semiconductor device structure and methods of forming the same202311,652,055Interconnect structure with hybrid barrier layer202311,640,940Methods of forming interconnection structure including conductive graphene layers202311,605,591Semiconductor device structure and methods of forming the same202311,532,549Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (17)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 17 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 17 | 2022–2026 |