Inventor
KOHEI SEYAMA
Inventor
JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H05KPrinted circuits11%
B23KSoldering or unsoldering6%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors2%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables2%
B25JManipulators1%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%
PatentTitleYear
12,575,368Apparatus for producing semiconductor device, and method for producing semiconductor device202612,568,792Semiconductor device manufacturing device and manufacturing method202612,557,682Mounting device comprising semiconductor chip mounted through thermo-compression tool and mounting method thereof202612,400,993Substrate holder and bonding system202512,341,035Mounting device202512,191,276Mounting apparatus202512,176,317Semiconductor device manufacturing device and manufacturing method202412,131,921Manufacturing apparatus of semiconductor device202412,112,962Arrangement apparatus and arrangement method202411,769,749Mounting apparatus202311,749,541Bonding apparatus202311,664,344Mounting apparatus202311,569,192Method for producing structure, and structure202311,509,126Wiring structure with movement mechanism202211,508,688Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips202211,469,125Device and method for linearly moving first and second moving bodies relative to target object202211,410,866Apparatus and method for linearly moving movable body relative to object202211,410,960Bonding apparatus202211,393,700Bonding apparatus and bonding method202211,373,975Electronic component mounting device202211,302,666Mounting head202211,139,193Device and method for positioning first object in relation to second object2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to SHINKAWA KK (18)· patent assignee history
2021–2026Based in JP· patent location history
2022Patents assigned to YAMAHA MOTOR ROBOTICS HOLDINGS CO LTD (1)· patent assignee history
2023Patents assigned to UNIV TOHOKU (1)· patent assignee history
2026Patents assigned to YAMAHA ROBOTICS CO LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKAWA KK | 18 | 2021–2025 |
| YAMAHA ROBOTICS CO LTD | 3 | 2026 |
| UNIV TOHOKU | 1 | 2023 |
| YAMAHA MOTOR ROBOTICS HOLDINGS CO LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 22 | 2021–2026 |