Inventor

Shinzo Higuchi

Inventor
Tokyo, JP

Overview

4→
Patents
2014–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Bprimary
B29BPreparation or pretreatment of the material to be shaped16%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering16%
B29CShaping or joining of plastics11%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts11%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients11%
C08LCompositions of macromolecular compounds11%
B05DProcesses for applying fluent materials to surfaces, in general5%
C08JWorking-up5%
D01FChemical features in the manufacture of artificial filaments, threads, fibres, bristles or ribbons5%
G03GElectrography5%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2021Patents assigned to HIGUCHI SHINZO (4)· patent assignee history
2014–2021Patents assigned to RICOH CO LTD (4)· patent assignee history
2014Based in Numazu, JP· patent location history
2020–2021Patents assigned to IWATSUKI HITOSHI (3)· patent assignee history
2020–2021Patents assigned to SAITO AKIRA (3)· patent assignee history
2020–2021Patents assigned to SUZUKI YASUO (3)· patent assignee history
2020–2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HIGUCHI SHINZOself42014–2021
RICOH CO LTD42014–2021
IWATSUKI HITOSHI32020–2021
SAITO AKIRA32020–2021
SUZUKI YASUO32020–2021
Locations
LocationPatentsSpan
Tokyo, JP32020–2021
Numazu, JP12014