Inventor
Chun-Yen Lo
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
C25DProcesses for the electrolytic or electrophoretic production of coatings18%
PatentTitleYear
10,741,513Conductive external connector structure and method of forming202010,535,554Semiconductor die having edge with multiple gradients and method for forming the same202010,163,836Conductive external connector structure and method of forming20189,875,979Conductive external connector structure and method of forming20187,187,078'Bump structure'20077,122,458'Method for fabricating pad redistribution layer'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2007Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
2006–2007Based in Taichung, TW· patent location history
2018–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2018–2020Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2018–2020 |
| TAIWAN SEMICONDUCTOR MFG | 2 | 2006–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 4 | 2018–2020 |
| Taichung, TW | 2 | 2006–2007 |