Inventor
Arulkumar Shanmugasundram
Inventor
Sunnyvale, CA, US
Overview
Patents· 40 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
G05BControl or regulating systems in general16%
Y02PClimate change mitigation technologies in the production or processing of goods14%
C23CCoating metallic material11%
B24BMachines, devices, or processes for grinding or polishing9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
B82YSpecific uses or applications of nanostructures3%
C25DProcesses for the electrolytic or electrophoretic production of coatings3%
H10DInorganic electric semiconductor devices3%
C23FNon-mechanical removal of metallic material from surface2%
PatentTitleYear
8,694,145'Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles'20148,308,858'Electroless deposition process on a silicon contact'20128,070,909'Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles'20118,005,634'Copper wiring module control'20117,970,588'Method, system and medium for controlling manufacturing process using adaptive models based on empirical data'20117,966,087'Method, system and medium for controlling manufacture process having multivariate input parameters'20117,910,476'Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop'20117,827,930'Apparatus for electroless deposition of metals onto semiconductor substrates'20107,783,375'Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing'20107,725,208'Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing'20107,698,012'Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing'20107,668,702'Method, system and medium for controlling manufacturing process using adaptive models based on empirical data'20107,659,203'Electroless deposition process on a silicon contact'20107,654,221'Apparatus for electroless deposition of metals onto semiconductor substrates'20107,651,934'Process for electroless copper deposition'20107,542,132'Raman spectroscopy as integrated chemical metrology'20097,534,298'Apparatus and method of detecting the electroless deposition endpoint'20097,514,353'Contact metallization scheme using a barrier layer over a silicide layer'20097,473,339'Slim cell platform plumbing'20097,341,633'Apparatus for electroless deposition'20087,337,019'Integration of fault detection with run-to-run control'20087,323,058'Apparatus for electroless deposition of metals onto semiconductor substrates'20087,273,813'Wafer cleaning solution for cobalt electroless application'20077,272,459'Method, system and medium for controlling manufacture process having multivariate input parameters'20077,256,111'Pretreatment for electroless deposition'20077,247,080'Feedback controlled polishing processes'20077,223,323'Multi-chemistry plating system'20077,205,233'Method for forming CoWRe alloys by electroless deposition'20077,201,936'Method of feedback control of sub-atmospheric chemical vapor deposition processes'20077,160,739'Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles'20077,082,345'Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities'20067,047,099'Integrating tool, module, and fab level control'20067,024,268'Feedback controlled polishing processes'20066,999,836'Method, system, and medium for handling misrepresentative metrology data within an advanced process control system'20066,913,938'Feedback control of plasma-enhanced chemical vapor deposition processes'20056,887,124'Method of polishing and cleaning substrates'20056,625,513'Run-to-run control over semiconductor processing tool based upon mirror image target'20036,413,145'System for polishing and cleaning substrates'20026,350,188'Drive system for a carrier head support structure'20026,244,931'Buffer station on CMP system'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2014Patents assigned to APPLIED MATERIALS INC (40)· patent assignee history
2001–2005Based in Milpitas, CA, US· patent location history
2002–2011Based in Mountain View, CA, US· patent location history
2005–2014Based in Sunnyvale, CA, US· patent location history
2011–2014Patents assigned to PRABHU GOPALAKRISHNA B (2)· patent assignee history
2011–2014Patents assigned to SCHWARM ALEXANDER T (2)· patent assignee history
2011–2014Patents assigned to SHANMUGASUNDRAM ARULKUMAR P (2)· patent assignee history
2012Patents assigned to EAGLESHAM DAVID J (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 40 | 2001–2014 |
| PRABHU GOPALAKRISHNA B | 2 | 2011–2014 |
| SCHWARM ALEXANDER T | 2 | 2011–2014 |
| SHANMUGASUNDRAM ARULKUMAR Pself | 2 | 2011–2014 |
| EAGLESHAM DAVID J | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Sunnyvale, California, US | 34 | 2005–2014 |
| Milpitas, California, US | 4 | 2001–2005 |
| Mountain View, California, US | 2 | 2002–2011 |