Inventor
Wayne R. Storr
Inventor
New Milford, PA, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
Y10TTechnical subjects covered by former us classification33%
H10HInorganic light-emitting semiconductor devices having potential barriers22%
G01RMeasuring electric variables11%
PatentTitleYear
6,219,238'Structure for removably attaching a heat sink to surface mount packages'20016,150,716'Metal substrate having an IC chip and carrier mounting'20006,131,278'Metal substrate having an IC chip and carrier mounting'20005,420,520'Method and apparatus for testing of integrated circuit chips'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2001Patents assigned to IBM (4)· patent assignee history
1995Based in Great Bend, PA, US· patent location history
2000–2001Based in New Milford, PA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 4 | 1995–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Milford, Pennsylvania, US | 3 | 2000–2001 |
| Great Bend, Pennsylvania, US | 1 | 1995 |