Inventor
SHANG-YING TSAI
Inventor
TW
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices22%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems22%
H01LSemiconductor devices11%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure5%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry4%
B01LChemical or physical laboratory apparatus for general use4%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
PatentTitleYear
12,497,285Stopper bump structures for MEMS device202512,412,863Die attached leveling control by metal stopper bumps202512,358,783Wire-bond damper for shock absorption202512,322,722Die attached leveling control by metal stopper bumps202512,303,888Method to produce chemical pattern in micro-fluidic structure202512,191,185Vacuum wafer chuck for manufacturing semiconductor devices202511,993,510Composite spring structure to reinforce mechanical robustness of a MEMS device202411,987,494Wire-bond damper for shock absorption202411,923,331Die attached leveling control by metal stopper bumps202411,765,975Thermocouple device202311,713,242MEMS device with dummy-area utilization for pressure enhancement202311,661,333Semiconductor structure and manufacturing method thereof202311,591,211Semiconductive structure and manufacturing method thereof202311,542,151MEMS apparatus with anti-stiction layer202311,530,130Method of making ohmic contact on low doped bulk silicon for optical alignment202211,508,608Vacuum wafer chuck for manufacturing semiconductor devices202211,485,631Method of making ohmic contact on low doped bulk silicon for optical alignment202211,420,866Composite spring structure to reinforce mechanical robustness of a MEMS device202211,298,697Method to produce chemical pattern in micro-fluidic structure202211,251,354Thermocouple device202211,174,158MEMS device with dummy-area utilization for pressure enhancement2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (19)· patent assignee history
2021–2025Based in TW· patent location history
2022–2025Patents assigned to ILLUMINA INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 19 | 2021–2025 |
| ILLUMINA INC | 2 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 21 | 2021–2025 |