Inventor

Juan Manuel GARCIA REYERO VINAS

Inventor

Overview

2→

Patents

2022

Patent span

Physics

Primary field (CPC G)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B33Yprimary

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering40%

G05BControl or regulating systems in general20%

G06FElectric digital data processing20%

G06TImage data processing or generation, in general20%

PatentTitleYear

11,320,802Method for setting printing properties of a three-dimensional object for additive manufacturing process2022 11,222,463Three-dimensional object representation2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history

2022Based in ES· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HEWLETT PACKARD DEVELOPMENT CO	2	2022

Locations

Location	Patents	Span
ES	2	2022