Inventor
Joy WATANABE
Inventor
US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,272,677Direct bonded stack structures for increased reliability and improved yield in microelectronics202511,955,463Direct bonded stack structures for increased reliability and improved yield in microelectronics202411,296,053Direct bonded stack structures for increased reliability and improved yield in microelectronics2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to INVENSAS BONDING TECH INC (1)· patent assignee history
2022–2025Based in US· patent location history
2024–2025Patents assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC | 2 | 2024–2025 |
| INVENSAS BONDING TECH INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 3 | 2022–2025 |