Inventor

Glenn L. Kehley

Inventor

Endicott, NY, US

Overview

1997–2010

Patent span

Electricity

Primary field (CPC H)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits31%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H01RElectrically-conductive connections15%

A47GHousehold or table equipment8%

H04NPictorial communication, e.g. television8%

G06VImage or video recognition or understanding4%

Y10TTechnical subjects covered by former us classification4%

PatentTitleYear

7,672,479'Low maintenance flat mail line scan camera system'2010 7,350,690'Method and apparatus for containing mail articles deposited in a mail drop box'2008 7,175,068'Method and apparatus for containing mail articles deposited in a mail drop box'2007 6,809,330'Automatic calibration and built-in diagnostic procedures for line scan cameras'2004 6,534,763'Low maintenance line scan camera'2003 6,256,203'Free standing, three dimensional, multi-chip, carrier package with air flow baffle'2001 6,075,287'Integrated, multi-chip, thermally conductive packaging device and methodology'2000 6,061,245'Free standing, three dimensional, multi-chip, carrier package with air flow baffle'2000 6,037,658'Electronic package with heat transfer means'2000 5,984,691'Flexible circuitized interposer with apertured member and method for making same'1999 5,938,454'Electrical connector assembly for connecting first and second circuitized substrates'1999 5,926,369'Vertically integrated multi-chip circuit package with heat-sink support'1999 5,919,050'Method and apparatus for separable interconnecting electronic components'1999 5,759,047'Flexible circuitized interposer with apertured member and method for making same'1998 5,673,177'Heat sink structure with corrugated wound wire heat conductive elements'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2001Patents assigned to IBM (10)· patent assignee history

1997–2010Based in Endicott, NY, US· patent location history

2003–2010Patents assigned to LOCKHEED CORP (5)· patent assignee history

2007–2008Based in Owego, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	10	1997–2001
LOCKHEED CORP	5	2003–2010

Locations

Location	Patents	Span
Endicott, New York, US	13	1997–2010
Owego, New York, US	2	2007–2008