Inventor
Haruo Kojima
Inventor
Kawasaki, JP
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H03FAmplifiers14%
B03CMagnetic or electrostatic separation of solid materials from solid materials or fluids7%
G01SRadio direction-finding7%
A63FCard, board, or roulette games4%
B01DSeparation4%
B03BSeparating solid materials using liquids or using pneumatic tables or jigs4%
B23KSoldering or unsoldering4%
C22BProduction and refining of metals4%
C23CCoating metallic material4%
PatentTitleYear
11,117,054Player induced counter-balancing of loads on a character in a virtual environment20218,581,664'Pulse electric power amplification apparatus'20138,259,686'Array antenna system and transmit/receive module thereof'20128,223,080'Transmission and reception module'20127,781,259'Method of manufacturing a semiconductor using a rigid substrate'20107,436,353'Transmitting-receiving module of radar system'20087,423,491'Semiconductor amplifier'20087,372,315'Switching circuit using semiconductor switching element'20087,262,668'Semiconductor amplifier'20077,122,402'Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrate'20067,123,089'Power amplifier with pulse differentiating circuit'20067,009,462'Limiter circuit'20066,762,493'Microwave integrated circuit'20046,383,397'Method for separating magnetic particles mixed in fluid, separating system, and separator'20026,166,433'Resin molded semiconductor device and method of manufacturing semiconductor package'20006,138,833'Placer gold mining method, placer gold mining boat used in this method, placer gold digging and separating method and system therefor, and placer gold separating method and system therefor'20006,023,080'Input/output connection structure of a semiconductor device'20005,244,512'Method for treating metal surface with zinc phosphate'19934,710,250'Method for producing a package for a semiconductor device'19874,278,865'Gas shielded stud welding method'1981Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2006Patents assigned to FUJITSU LTD (3)· patent assignee history
2000–2013Patents assigned to TOSHIBA KK (11)· patent assignee history
2000Patents assigned to JIPANGU INC (1)· patent assignee history
2000–2008Based in Kawasaki, JP· patent location history
2002Based in Gifu, JP· patent location history
2006–2010Based in Aizuwakamatsu, JP· patent location history
2007–2013Based in Kanagawa, JP· patent location history
2010Patents assigned to FUJITSU SEMICONDUCTOR LTD (1)· patent assignee history
2012–2013Patents assigned to KOJIMA HARUO (3)· patent assignee history
2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 11 | 2000–2013 |
| FUJITSU LTD | 3 | 1987–2006 |
| KOJIMA HARUOself | 3 | 2012–2013 |
| FUJITSU SEMICONDUCTOR LTD | 1 | 2010 |
| JIPANGU INC | 1 | 2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 7 | 2000–2008 |
| Kanagawa, JP | 5 | 2007–2013 |
| Aizuwakamatsu, JP | 2 | 2006–2010 |
| Tokyo, JP | 1 | 2021 |
| Gifu, JP | 1 | 2002 |