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Inventor

Yuming WEI

Inventor
CN

Overview

2→
Patents
2022–2025
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices33%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems33%
LOC1033%
PatentTitleYear
D1107570Constructive light imaging device for 3D measurement or surface inspection202511,242,243MEMS chip and electrical packaging method for MEMS chip2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to HUAWEI TECH CO LTD (1)· patent assignee history
2022–2025Based in CN· patent location history
2025Patents assigned to SHENZHEN HANSWELL TECH CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUAWEI TECH CO LTD12022
SHENZHEN HANSWELL TECH CO LTD12025
Locations
LocationPatentsSpan
CN22022–2025