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Inventor

Ning Liu

Inventor
Shenzhen, CN

Overview

5→
Patents
2009–2020
Patent span
Physics
Primary field (CPC G)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics27%
G06KGraphical data reading27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
G06FElectric digital data processing18%
PatentTitleYear
10,599,636Service outage time reduction for a planned event in a system202010,558,648Service outage time reduction for a planned event in a system20208,482,139'Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards'20138,232,145'Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards'20127,615,861'Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2013Based in Shenzhen, CN· patent location history
2012–2013Patents assigned to CHANG CHE-JUNG (2)· patent assignee history
2012–2013Patents assigned to CHIEN JACK CHANG (2)· patent assignee history
2012–2013Patents assigned to CHIU CHIN-TIEN (2)· patent assignee history
2012–2013Patents assigned to LIU NING (2)· patent assignee history
2020Patents assigned to IBM (2)· patent assignee history
2020Based in Beijing, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHANG CHE-JUNG22012–2013
CHIEN JACK CHANG22012–2013
CHIU CHIN-TIEN22012–2013
IBM22020
LIU NINGself22012–2013
Locations
LocationPatentsSpan
Shenzhen, CN32009–2013
Beijing, CN22020