Inventor

David Gani

Inventor

Singapore, SG

Overview

15→

Patents

2002–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%

H01LSemiconductor devices14%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation12%

G01SRadio direction-finding8%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light4%

G01VGeophysics4%

G02BOptical elements, systems or apparatus4%

G03BApparatus or arrangements for taking photographs or for projecting or viewing them4%

H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light4%

PatentTitleYear

11,069,667Wafer level proximity sensor2021 10,910,287Semiconductor package with protected sidewall and method of forming the same2021 10,763,194Package with lead frame with improved lead design for discrete electrical components and manufacturing the same2020 10,422,860Proximity sensor with integrated ALS2019 10,147,834Overmold proximity sensor and associated methods2018 9,793,427'Air venting on proximity sensor'2017 9,768,216'Image sensor device with different width cell layers and related methods'2017 9,671,671'Optical assembly including electrically conductive coupling member and related methods'2017 9,525,094'Proximity and ranging sensor'2016 9,244,334'Contact having an angled portion'2016 8,642,119'Method and system for shielding semiconductor devices from light'2014 8,576,574'Electromagnetic interference shielding on semiconductor devices'2013 8,492,181'Embedded wafer level optical package structure and manufacturing method'2013 7,183,367'Vinyl sulphone modified polymer'2007 6,486,354'Solid phase supports'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002Patents assigned to AKZO NOBEL NV (1)· patent assignee history

2002–2007Based in Birmingham, GB· patent location history

2013–2021Patents assigned to ST MICROELECTRONICS PTE LTD (13)· patent assignee history

2013–2014Patents assigned to GANI DAVID (3)· patent assignee history

2013–2014Patents assigned to DE LOS REYES GLENN (2)· patent assignee history

2013–2014Patents assigned to WONG WINGSHENQ (2)· patent assignee history

2013–2021Based in Singapore, SG· patent location history

2013Based in Yishun, SG· patent location history

2017–2021Based in Choa Chu Kang, SG· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ST MICROELECTRONICS PTE LTD	13	2013–2021
GANI DAVIDself	3	2013–2014
DE LOS REYES GLENN	2	2013–2014
WONG WINGSHENQ	2	2013–2014
AKZO NOBEL NV	1	2002

Locations

Location	Patents	Span
Singapore, SG	8	2013–2021
Choa Chu Kang, SG	4	2017–2021
Birmingham, GB	2	2002–2007
Yishun, SG	1	2013