LexDanaLexDanabeta
Inventor

Tomoko Owada

Inventor
Tokyo, JP

Overview

3→
Patents
2019–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

LOC13primary
LOC1340%
B24BMachines, devices, or processes for grinding or polishing20%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
11,088,011Elastic membrane, substrate holding device, and polishing apparatus2021D0859332Elastic membrane for semiconductor wafer polishing2019D0839224Elastic membrane for semiconductor wafer polishing2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2021Patents assigned to EBARA CORP (3)· patent assignee history
2019–2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP32019–2021
Locations
LocationPatentsSpan
Tokyo, JP32019–2021