Inventor
Roger Duane Hamilton
Inventor
Eyota, MN, US
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H05KPrinted circuits27%
Y10TTechnical subjects covered by former us classification19%
H01RElectrically-conductive connections8%
H01LSemiconductor devices6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding2%
G01MTesting static or dynamic balance of machines or structures2%
G01RMeasuring electric variables2%
G06FElectric digital data processing2%
PatentTitleYear
10,779,391Integrated circuit device assembly202010,109,975Module placement apparatus20189,913,361'Integrated circuit device assembly'20189,265,157'Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint'20168,363,404'Implementing loading and heat removal for hub module assembly'20137,944,698'Mounting a heat sink in thermal contact with an electronic component'20117,777,329'Heatsink apparatus for applying a specified compressive force to an integrated circuit device'20107,765,693'Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member'20107,606,033'Mounting a heat sink in thermal contact with an electronic component'20097,486,516'Mounting a heat sink in thermal contact with an electronic component'20097,345,881'Non-influencing fastener for mounting a heat sink in contact with an electronic component'20087,293,994'Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member'20077,071,720'Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit'20066,988,533'Method and apparatus for mounting a heat transfer apparatus upon an electronic component'20066,802,733'Topside installation apparatus for land grid array modules'20046,792,375'Apparatus, system, and method of determining loading characteristics on an integrated circuit module'20046,757,965'Method of installing a land grid array multi-chip modules'20046,634,095'Apparatus for mounting a land grid array module'20036,475,011'Land grid array socket actuation hardware for MCM applications'20026,449,155'Land grid array subassembly for multichip modules'20026,385,044'Heat pipe heat sink assembly for cooling semiconductor chips'20026,061,240'Push pin assembly for heat sink for cooling electronic modules'20005,978,223'Dual heat sink assembly for cooling multiple electronic modules'19995,940,266'Bi-directional cooling arrangement for use with an electronic component enclosure'19995,929,377'Apparatus for preventing leakage of electromagnetic radiation from electronic enclosures'19995,870,286'Heat sink assembly for cooling electronic modules'19995,617,296'Printed circuit board covers for an electronics package'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2020Patents assigned to IBM (27)· patent assignee history
1997–2006Based in Eyota, MN, US· patent location history
2006–2020Based in Rochester, MN, US· patent location history
2013Patents assigned to COLBERT JOHN L (1)· patent assignee history
2013Patents assigned to EAGLE JASON R (1)· patent assignee history
2013Patents assigned to HAMILTON ROGER D (1)· patent assignee history
2013Patents assigned to MARSTON KENNETH C (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 27 | 1997–2020 |
| COLBERT JOHN L | 1 | 2013 |
| EAGLE JASON R | 1 | 2013 |
| HAMILTON ROGER Dself | 1 | 2013 |
| MARSTON KENNETH C | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Eyota, Minnesota, US | 14 | 1997–2006 |
| Rochester, Minnesota, US | 13 | 2006–2020 |