Inventor
Michael A. Cracraft
Inventor
Poughkeepsie, NY, US
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing44%
G06NComputing arrangements based on specific computational models13%
G01RMeasuring electric variables12%
H01RElectrically-conductive connections8%
H05KPrinted circuits8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
H01PWaveguides2%
H04BTransmission2%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use2%
PatentTitleYear
11,050,172Insertable stubless interconnect202110,984,155Accelerating particle-swarm algorithms202110,928,426Removable transient voltage detector202110,663,486Portable electrical noise probe structure202010,657,308Signal via positioning in a multi-layer circuit board202010,437,948Accelerating particle-swarm algorithms201910,324,879Mitigation of side effects of simultaneous switching of input/output (I/O data signals201910,310,571Cable cassette apparatus201910,310,570Cable cassette apparatus201910,289,170Cable cassette apparatus201910,289,169Cable cassette apparatus201910,228,733Cable cassette apparatus201910,223,490Signal via positioning in a multi-layer circuit board using a genetic via placement solver201910,216,884Signal via positioning in a multi-layer circuit board using a genetic via placement solver201910,184,962Removable transient voltage detector201910,095,278Cable cassette apparatus201810,019,044Cable cassette apparatus201810,013,513Accelerating particle-swarm algorithms20189,996,640Accelerating particle-swarm algorithms20189,940,426Signal via positioning in a multi-layer circuit board20189,916,410'Signal via positioning in a multi-layer circuit board'20189,915,682'Non-permanent termination structure for microprobe measurements'20189,881,115'Signal via positioning in a multi-layer circuit board using a genetic via placement solver'20189,875,331Signal via positioning in a multi-layer circuit board using a genetic via placement solver20189,804,216'Detection of electromagnetic field with electroactive polymers'20179,747,549'Guiding metaheuristic to search for best of worst'20179,702,906'Non-permanent termination structure for microprobe measurements'20179,627,787'DIMM connector region vias and routing'20179,548,773'Mitigation of EMI/ESD-caused transmission errors on an electronic circuit'20179,548,551'DIMM connector region vias and routing'20179,444,162'DIMM connector region vias and routing'20169,256,824'Guiding metaheuristic to search for best of worst'20169,251,460'Guiding metaheuristic to search for best of worst'20169,021,173'High speed differential wiring strategy for serially attached SCSI systems'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2021Patents assigned to IBM (34)· patent assignee history
2015–2021Based in Poughkeepsie, NY, US· patent location history
2016Patents assigned to CANTIN JASON F (1)· patent assignee history
2016Patents assigned to CRACRAFT MICHAEL A (1)· patent assignee history
2019Patents assigned to INT BUSINESS MACHINES CORPORTION (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 34 | 2015–2021 |
| CANTIN JASON F | 1 | 2016 |
| CRACRAFT MICHAEL Aself | 1 | 2016 |
| INT BUSINESS MACHINES CORPORTION | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 34 | 2015–2021 |