Inventor
Nobuhisa Kuroda
Inventor
Ogaki, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits37%
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
Y10TTechnical subjects covered by former us classification11%
H01GCapacitors5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
PatentTitleYear
10,314,166Printed wiring board20199,930,791'Wiring board with built-in electronic component and method for manufacturing the same'20189,743,534'Wiring board with built-in electronic component and method for manufacturing the same'20179,374,903'Multilayer printed wiring board for mounting semiconductor element'20169,185,806'Method for manufacturing printed wiring board and printed wiring board'20158,309,856'Circuit board and manufacturing method thereof'20128,110,752'Wiring substrate and method for manufacturing the same'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2019Patents assigned to IBIDEN CO LTD (7)· patent assignee history
2012Patents assigned to KURODA NOBUHISA (2)· patent assignee history
2012Patents assigned to AWANO ATSUSHI (1)· patent assignee history
2012Patents assigned to KUBOTA NAOKI (1)· patent assignee history
2012Patents assigned to NAGAYA FUSAJI (1)· patent assignee history
2012–2019Based in Ogaki, JP· patent location history
2012Based in Gifu, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBIDEN CO LTD | 7 | 2012–2019 |
| KURODA NOBUHISAself | 2 | 2012 |
| AWANO ATSUSHI | 1 | 2012 |
| KUBOTA NAOKI | 1 | 2012 |
| NAGAYA FUSAJI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ogaki, JP | 6 | 2012–2019 |
| Gifu, JP | 1 | 2012 |