Inventor

XIAOXIN SONG

Inventor
CN

Overview

27→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 27 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices16%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein9%
H10DInorganic electric semiconductor devices8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
H10KOrganic electric solid-state devices7%
H10NElectric solid-state devices not otherwise provided for7%
G02BOptical elements, systems or apparatus6%
G06VImage or video recognition or understanding6%
H10HInorganic light-emitting semiconductor devices having potential barriers6%
G06FElectric digital data processing4%
PatentTitleYear
12,368,144Driving backplane, transfer method for light-emitting diode chip, display apparatus202512,199,081Display substrate and preparation method thereof, and display apparatus202512,183,748Array substrate, display apparatus, and method of fabricating array substrate202412,153,305Backlight module and manufacturing method thereof and electronic device202412,033,994Display panel and preparation method thereof202411,968,901Displaying substrate, manufacturing method thereof, and display panel202411,953,779Backlight module, method for designing the same, and display device202411,953,680See-through display device and manufacturing method thereof202411,869,897Array substrate, display apparatus, and method of fabricating array substrate202411,864,415Display panel and preparation method thereof, and display apparatus202411,817,307Display substrate and method for manufacturing the same202311,759,778Electrode plate, microfluidic chip and method of manufacturing electrode plate202311,737,367Piezoelectric device and method for manufacturing the same, and display apparatus202311,736,865Transducer, method of manufacturing transducer, and transducing device202311,703,478Micro total analysis system, operating method and manufacturing method thereof202311,678,530Display substrate and preparation method thereof, and display apparatus202311,650,449Display panel and display apparatus202311,460,735Display panel and preparation method thereof, and display apparatus202211,442,583Fingerprint identification module, manufacturing method thereof and electronic device202211,436,856Method for manufacturing fingerprint recognition module, fingerprint recognition module, and display device202211,397,290Filter structure and method for manufacturing same, and display device202211,398,590Detection substrate, preparation method thereof, detection device and detection method202211,378,839Transparent display panel, preparation method thereof and display device202211,373,585Driving backplane, display panel and method for manufacturing the same202211,301,082Fingerprint recognition unit and fabrication method thereof, fingerprint recognition module and display device202211,296,165Array substrate, display apparatus, and method of fabricating array substrate202211,296,160Display substrate, display apparatus, and method of fabricating the display substrate2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to BOE TECHNOLOGY GROUP CO LTD (26)· patent assignee history
2022Patents assigned to BEIJING BOE TECHNOLOGY DEV CO LTD (3)· patent assignee history
2022–2025Based in CN· patent location history
2024Patents assigned to LENOVO BEIJING LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
BOE TECHNOLOGY GROUP CO LTD262022–2025
BEIJING BOE TECHNOLOGY DEV CO LTD32022
LENOVO BEIJING LTD12024
Locations
LocationPatentsSpan
CN272022–2025