LexDanaLexDanabeta
Inventor

Toshihiro Hayami

Inventor
Nirasaki, JP

Overview

30→
Patents
1997–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 30 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Jprimary
H01JElectric discharge tubes or discharge lamps33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
C23CCoating metallic material6%
H01LSemiconductor devices6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B24BMachines, devices, or processes for grinding or polishing5%
H05HPlasma technique4%
B05DProcesses for applying fluent materials to surfaces, in general3%
F25DRefrigerators3%
B22DCasting of metals1%
PatentTitleYear
11,017,521Bottle storage and system202110,854,431Plasma processing apparatus and method202010,546,727Plasma processing apparatus and method202010,529,539Plasma processing apparatus and method20209,490,105'Plasma processing apparatus and method'20169,199,303'Metal filling apparatus'20158,852,388'Plasma processor'20148,771,461'Plasma processing apparatus'20148,628,640'Plasma processing unit and high-frequency electric power supplying unit'20148,603,293'Plasma processing apparatus and method'20138,286,581'High frequency power source and its control method, and plasma processing apparatus'20128,157,952'Plasma processing chamber, potential controlling apparatus, potential controlling method, program for implementing the method, and storage medium storing the program'20128,038,833'Plasma processing apparatus'20117,988,816'Plasma processing apparatus and method'20117,951,262'Plasma processing apparatus and method'20117,895,970'Structure for plasma processing chamber, plasma processing chamber, plasma processing apparatus, and plasma processing chamber component'20117,870,751'Temperature control system and substrate processing apparatus'20117,815,740'Substrate mounting table, substrate processing apparatus and substrate processing method'20107,767,055'Capacitive coupling plasma processing apparatus'20107,718,007'Substrate supporting member and substrate processing apparatus'20107,368,876'Plasma processing apparatus'20087,008,275'Electrical joint forming member and plasma processing apparatus'20066,669,810'Method for detecting etching endpoint, and etching apparatus and etching system using the method thereof'20036,149,761'Etching apparatus and etching system using the method thereof'20006,092,486'Plasma processing apparatus and plasma processing method'20006,091,045'Plasma processing apparatus utilizing a microwave window having a thinner inner area'20005,951,887'Plasma processing apparatus and plasma processing method'19995,885,472'Method for detecting etching endpoint, and etching apparatus and etching system using the method thereof'19995,705,019'Plasma processing apparatus'19985,626,714'Method for detecting etching endpoint and etching apparatus and etching system using the method thereof'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2003Patents assigned to SUMITOMO METAL IND (7)· patent assignee history
1997–2021Based in Osaka, JP· patent location history
1998–2000Based in Nishinomiya, JP· patent location history
2006–2020Based in Nirasaki, JP· patent location history
2008–2020Patents assigned to TOKYO ELECTRON LTD (17)· patent assignee history
2008–2010Patents assigned to TOSHIBA KK (2)· patent assignee history
2012–2015Patents assigned to HAYAMI TOSHIHIRO (7)· patent assignee history
2014Patents assigned to SPP TECHNOLOGIES CO LTD (2)· patent assignee history
2014Based in Amagasaki, JP· patent location history
2015Based in Hyogo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOKYO ELECTRON LTD172008–2020
HAYAMI TOSHIHIROself72012–2015
SUMITOMO METAL IND71997–2003
SPP TECHNOLOGIES CO LTD22014
TOSHIBA KK22008–2010
Locations
LocationPatentsSpan
Nirasaki, JP182006–2020
Osaka, JP51997–2021
Nishinomiya, JP41998–2000
Amagasaki, JP22014
Hyogo, JP12015