Inventor
Yoji Murakami
Inventor
Sagamihara, JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification24%
C08JWorking-up9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
B29CShaping or joining of plastics7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
B41MPrinting, duplicating, marking, or copying processes7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B29DProducing particular articles from plastics or from substances in a plastic state4%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4%
PatentTitleYear
11,092,336Method for estimating water content, and estimation device202110,911,675Method for providing shake correction, signal processing device performing the method, and imaging device including the signal processing device20215,618,621'Biaxially oriented laminated polyester film for use as film to be bonded onto metal sheet'19975,610,080'Method for producing semiconductor device having a body with a carrier ring connected thereto'19975,473,004'Polyester film for fabrication'19955,473,199'Semiconductor device having a body with a carrier ring connected thereto'19955,384,354'Polyester film for lamination onto metal sheet for processing of said sheet, and use thereof'19955,372,867'Polyester film for laminated metal sheet drawing and processing containing solid lubricant and having specified protrusion rate'19945,240,779'Polyester film for fabrication'19935,094,982'Lead frame and method of producing electronic components using such improved lead frame'19925,077,118'Stamping foil'19915,069,944'Thermal transfer record sheet'19914,977,442'Lead frame and method of producing electronic components using such improved lead frame'19904,937,224'Thermal transfer record sheet'19904,900,485'Method and apparatus for transfer molding'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–1997Patents assigned to TEIJIN LTD (8)· patent assignee history
1990–1997Patents assigned to FUJITSU LTD (5)· patent assignee history
1990–1997Based in Sagamihara, JP· patent location history
1990–1992Based in Aizuwakamatsu, JP· patent location history
1995–1997Based in Kawasaki, JP· patent location history
2021Patents assigned to DENSO WAVE INC (1)· patent assignee history
2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history
2021Based in Toyota-shi, Aichi-ken, JP· patent location history
2021Based in Yokohama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEIJIN LTD | 8 | 1990–1997 |
| FUJITSU LTD | 5 | 1990–1997 |
| DENSO WAVE INC | 1 | 2021 |
| SAMSUNG ELECTRONICS CO LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Sagamihara, JP | 8 | 1990–1997 |
| Kawasaki, JP | 2 | 1995–1997 |
| Aizuwakamatsu, JP | 2 | 1990–1992 |
| Toyota-shi, Aichi-ken, JP | 1 | 2021 |
| Yokohama, JP | 1 | 2021 |