Inventor
VOLUME CHIEN
Inventor
TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices37%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation37%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H04NPictorial communication, e.g. television7%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
12,288,798Backside illuminated image sensor device with shielding layer and forming method202511,810,939Method of forming backside illuminated image sensor device with shielding layer202311,778,320Method of manufacturing integrated circuit device202311,735,619Semiconductor image sensor device having back side illuminated image sensors with embedded color filters202311,355,545Semiconductor image sensor device having back side illuminated image sensors with embedded color filters202211,335,721Backside illuminated image sensor device with shielding layer202211,336,814Integrated circuit device202211,227,886Mechanisms for forming image sensor device202211,177,306Support structure for integrated circuitry202111,152,414Image sensor including dual isolation and method of making the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (10)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 10 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 10 | 2021–2025 |