Inventor
Joseph K. V. Comeau
Inventor
Essex Junction, VT, US
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Gprimary
C09GPolishing compositions15%
C09KMaterials for miscellaneous applications, not provided for elsewhere15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
G01NInvestigating or analysing materials by determining their chemical or physical properties8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
C11DDetergent compositions5%
C23CCoating metallic material5%
C23FNon-mechanical removal of metallic material from surface5%
F04FPumping of fluid by direct contact of another fluid or by using inertia of fluid to be pumped5%
G01RMeasuring electric variables5%
PatentTitleYear
10,571,490Solder bump array probe tip structure for laser cleaning20209,847,213Vacuum trap20179,835,653Solder bump array probe tip structure for laser cleaning20179,708,508'Slurry for chemical-mechanical polishing of metals and use thereof'20179,057,388'Vacuum trap'20159,057,004'Slurry for chemical-mechanical polishing of metals and use thereof'20158,734,665'Slurry for chemical-mechanical polishing of copper and use thereof'20148,636,917'Solution for forming polishing slurry, polishing slurry and related methods'20148,328,892'Solution for forming polishing slurry, polishing slurry and related methods'20128,236,580'Copper contamination detection method and system for monitoring copper contamination'20127,957,917'Copper contamination detection method and system for monitoring copper contamination'20117,888,142'Copper contamination detection method and system for monitoring copper contamination'20117,824,568'Solution for forming polishing slurry, polishing slurry and related methods'20107,442,552'Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging'20087,300,796'Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2020Patents assigned to IBM (13)· patent assignee history
2007–2014Based in Essex Junction, VT, US· patent location history
2012–2015Patents assigned to TIERSCH MATTHEW T (4)· patent assignee history
2012–2015Patents assigned to WHITE ERIC J (4)· patent assignee history
2014–2015Patents assigned to COMEAU JOSEPH K (3)· patent assignee history
2014–2015Patents assigned to BATES GRAHAM M (2)· patent assignee history
2014–2020Based in Alburgh, VT, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 13 | 2007–2020 |
| TIERSCH MATTHEW T | 4 | 2012–2015 |
| WHITE ERIC J | 4 | 2012–2015 |
| COMEAU JOSEPH Kself | 3 | 2014–2015 |
| BATES GRAHAM M | 2 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Essex Junction, VT, US | 8 | 2007–2014 |
| Alburgh, VT, US | 7 | 2014–2020 |