Inventor
Thomas Scheiter
Inventor
Munich, DE
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Lprimary
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure20%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock14%
G06VImage or video recognition or understanding12%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
G01DMeasuring not specially adapted for a specific variable4%
H10DInorganic electric semiconductor devices4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
7,054,469'Passivation layer structure'20066,714,392'Electronic component and utilization of a guard structure contained therein'20046,668,072'Method for producing a reference image for pattern recognition tasks'20036,664,612'Semiconductor component having double passivating layers formed of two passivating layers of different dielectric materials'20036,401,544'Micromechanical component protected from environmental influences'20026,365,888'Method for capacitive image acquisition'20026,320,239'Surface micromachined ultrasonic transducer'20016,159,762'Process for producing micromechanical sensors'20006,140,689'Micromechanical sensor'20006,094,985'Rotation rate sensor'20006,020,050'Semiconductor chip'20005,974,895'Capacitively measuring sensor and readout circuit'19995,918,110'Method for manufacturing a combination of a pressure sensor and an electrochemical sensor'19995,883,779'Pressure sensor'19995,834,332'Micromechanical semiconductor components and manufacturing method therefor'19985,760,455'Micromechanical semiconductor component and manufacturing method therefor'19985,700,702'Method for manufacturing an acceleration sensor'19975,662,772'Method for the selective removal of silicon dioxide'19975,631,428'Capacitive semiconductor pressure sensor'19975,450,754'Pressure sensor'19955,447,067'Acceleration sensor and method for manufacturing same'19955,431,051'Tunnel effect acceleration sensor'19955,373,181'Sensor for sensing fingerpaints and method for producing the sensor'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2003Patents assigned to SIEMENS AG (17)· patent assignee history
1994–2000Based in Munich, DE· patent location history
2000–2006Based in Oberhaching, DE· patent location history
2002–2006Patents assigned to INFINEON TECHNOLOGIES AG (5)· patent assignee history
2002Based in Strasslach, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SIEMENS AG | 17 | 1994–2003 |
| INFINEON TECHNOLOGIES AG | 5 | 2002–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Munich, DE | 13 | 1994–2000 |
| Oberhaching, DE | 9 | 2000–2006 |
| Strasslach, DE | 1 | 2002 |