Inventor
CHIN-YU KU
Inventor
TW
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10DInorganic electric semiconductor devices17%
H01FMagnets9%
H10NElectric solid-state devices not otherwise provided for7%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
C25DProcesses for the electrolytic or electrophoretic production of coatings1%
PatentTitleYear
12,500,149Semiconductor device and method of forming the same202512,376,317Semiconductor device structure with magnetic element202512,347,722Semiconductor device structure with a protection cap at an end portion of a conductive line202512,266,593Method of forming semiconductor device having at least one via including concave portions on sidewall202512,209,013Arched membrane structure for MEMS device202512,134,557Arched membrane structure for MEMS device202412,074,193Semiconductor device structure with magnetic element202411,984,419Package structure with a barrier layer202411,942,398Semiconductor device having at least one via including concave portions on sidewall202411,908,885Semiconductor device structure with magnetic element202411,855,007Semiconductor structure202311,769,716Semiconductor device and methods of forming the same202311,749,711Semiconductor device structure with magnetic element202311,621,317Semiconductor device structure with magnetic element covered by polymer material202311,594,484Forming bonding structures by using template layer as templates202311,557,508Semiconductor device structure having protection caps on conductive lines202311,527,504Conductive external connector structure and method of forming202211,469,203Method for forming package structure with a barrier layer202211,348,879Semiconductor structure202211,329,124Semiconductor device structure with magnetic element202211,233,116Semiconductor device structure with magnetic element2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (21)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 21 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 21 | 2022–2025 |