Inventor
Janusz Bryzek
Inventor
Fremont, CA, US
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Lprimary
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure11%
H01LSemiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
B81BMicrostructural devices or systems, e.g. micromechanical devices10%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems8%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock8%
H10DInorganic electric semiconductor devices7%
G02BOptical elements, systems or apparatus5%
A61BDiagnosis4%
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general4%
PatentTitleYear
11,058,396Low voltage, low power MEMS transducer with direct interconnect capability202111,039,814Imaging devices having piezoelectric transducers202110,966,683Integrated ultrasonic transducers202110,835,209Configurable ultrasonic imager202010,446,498Isolation between semiconductor components201910,065,851Microelectromechanical pressure sensor including reference capacitor20189,856,132'Sealed packaging for microelectromechanical systems'20189,802,814'Through silicon via including multi-material fill'20179,735,112'Isolation between semiconductor components'20179,586,813'Multi-die MEMS package'20179,425,328'Through silicon via including multi-material fill'20169,156,673'Packaging to reduce stress on microelectromechanical systems'20159,095,072'Multi-die MEMS package'20159,006,846'Through silicon via with reduced shunt capacitance'20158,710,599'Micromachined devices and fabricating the same'20147,539,003'Capacitive micro-electro-mechanical sensors with single crystal silicon electrodes'20097,518,493'Integrated tire pressure sensor system'20097,260,984'Power generation utilizing tire pressure changes'20077,076,146'Variable optical attenuator'20066,980,712'Optical system for calibration and control of an optical fiber switch'20056,922,500'Optical configuration for optical fiber switch'20056,898,341'Optical system for calibration and control of an optical fiber switch'20056,754,431'Variable optical attenuator'20046,636,656'System architecture of optical switching fabric'20036,559,379'Pressure sensor with transducer mounted on a metal base'20036,351,996'Hermetic packaging for semiconductor pressure sensors'20026,346,742'Chip-scale packaged pressure sensor'20026,255,728'Rigid encapsulation package for semiconductor devices'20016,229,190'Compensated semiconductor pressure sensor'20016,147,397'Stress isolated integrated circuit and method for making'20006,006,607'Piezoresistive pressure sensor with sculpted diaphragm'19995,062,302'Laminated semiconductor sensor with overpressure protection'19914,879,903'Three part low cost sensor housing'19894,414,853'Pressure transmitter employing non-linear temperature compensation'19834,196,382'Physical quantities electric transducers temperature compensation circuit'1980Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1980Based in Warsaw, PL· patent location history
1983Based in Santa Clara, CA, US· patent location history
1989–2009Based in Fremont, CA, US· patent location history
1999–2002Patents assigned to MAXIM INTEGRATED PRODUCTS (6)· patent assignee history
2004–2006Patents assigned to INTEL CORP (5)· patent assignee history
2014–2019Patents assigned to FAIRCHILD SEMICONDUCTOR (11)· patent assignee history
2014–2018Patents assigned to BRYZEK JANUSZ (6)· patent assignee history
2014–2018Patents assigned to ACAR CENK (5)· patent assignee history
2014–2021Based in Oakland, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FAIRCHILD SEMICONDUCTOR | 11 | 2014–2019 |
| BRYZEK JANUSZself | 6 | 2014–2018 |
| MAXIM INTEGRATED PRODUCTS | 6 | 1999–2002 |
| ACAR CENK | 5 | 2014–2018 |
| INTEL CORP | 5 | 2004–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fremont, California, US | 18 | 1989–2009 |
| Oakland, California, US | 15 | 2014–2021 |
| Santa Clara, California, US | 1 | 1983 |
| Warsaw, PL | 1 | 1980 |