Inventor
TUNG-HSING LEE
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10DInorganic electric semiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
G01RMeasuring electric variables9%
H01FMagnets9%
H01PWaveguides9%
PatentTitleYear
12,480,987Dynamic voltage stress condition optimization method and dynamic voltage stress condition optimization system capable of performing block-based dynamic voltage stress wafer testing process202511,610,839Dummy fill structures202311,289,474Passive devices over polycrystalline semiconductor fins202211,264,470Lateral bipolar junction transistor device and method of making such a device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to GLOBALFOUNDRIES US INC (3)· patent assignee history
2022–2023Based in US· patent location history
2025Patents assigned to MEDIATEK INC (1)· patent assignee history
2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLOBALFOUNDRIES US INC | 3 | 2022–2023 |
| MEDIATEK INC | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 3 | 2022–2023 |
| TW | 1 | 2025 |