Inventor
BENJAMIN D. BRIGGS
Inventor
US
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein6%
H10NElectric solid-state devices not otherwise provided for4%
G06FElectric digital data processing3%
G08GTraffic control systems3%
H10BElectronic memory devices3%
H10HInorganic light-emitting semiconductor devices having potential barriers3%
B64CAeroplanes2%
PatentTitleYear
12,538,778Fabricating dual damascene structures using multilayer photosensitive dielectrics202612,482,704Self-forming barrier for use in air gap formation202512,218,003Selective ILD deposition for fully aligned via with airgap202512,183,634Selective recessing to form a fully aligned via202412,087,685Semiconductor interconnect structure with double conductors202412,055,821Structure and method of bi-layer pixel isolation in advanced LCOS back-plane202411,908,678Method of CMP integration for improved optical uniformity in advanced LCOS back-plane202411,881,539Structure and method of advanced LCoS back-plane having highly reflective pixel via metallization202411,880,052Structure and method of mirror grounding in LCoS devices202411,869,783Optimizating semiconductor binning by feed-forward process adjustment202411,837,501Selective recessing to form a fully aligned via202311,790,072Paint on micro chip touch screens202311,756,786Forming high carbon content flowable dielectric film with low processing damage202311,735,524Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones202311,676,854Selective ILD deposition for fully aligned via with airgap202311,636,353Cognitive system for localized LIDAR pollution detection using autonomous vehicles202311,586,067Structure and method of advanced LCoS back-plane having robust pixel via metallization202311,587,830Self-forming barrier for use in air gap formation202311,574,864Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device202311,573,452Method for LCoS DBR multilayer stack protection via sacrificial hardmask for RIE and CMP processes202311,488,863Self-aligned contact scheme for pillar-based memory elements202211,348,872Hybrid dielectric scheme for varying liner thickness and manganese concentration202211,348,060Increasing cost benefit and energy efficiency with modular delivery drones in inclement weather202211,276,636Adjustable via dimension and chamfer angle202211,263,068Proximity correction in three-dimensional manufacturing202211,257,717Selective recessing to form a fully aligned via202211,195,993Encapsulation topography-assisted self-aligned MRAM top contact202111,164,377Motion-controlled portals in virtual reality202111,158,584Selective CVD alignment-mark topography assist for non-volatile memory202111,138,890Secure access for drone package delivery2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to IBM (14)· patent assignee history
2021–2026Based in US· patent location history
2022Patents assigned to TESSERA INC (1)· patent assignee history
2023–2026Patents assigned to APPLIED MATERIALS INC (7)· patent assignee history
2023–2024Patents assigned to TESSERA LLC (5)· patent assignee history
2023–2025Patents assigned to ADEIA SEMICONDUCTOR SOLUTIONS LLC (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 14 | 2021–2024 |
| APPLIED MATERIALS INC | 7 | 2023–2026 |
| TESSERA LLC | 5 | 2023–2024 |
| ADEIA SEMICONDUCTOR SOLUTIONS LLC | 4 | 2023–2025 |
| TESSERA INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 30 | 2021–2026 |