LexDanaLexDanabeta
Inventor

Reiner Willeke

Inventor
Dresden, DE

Overview

3→
Patents
2015–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
C23FNon-mechanical removal of metallic material from surface18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
B23KSoldering or unsoldering9%
PatentTitleYear
9,773,744'Solder bump cleaning before reflow'20179,214,436'Etching of under bump mettallization layer and resulting device'20159,159,683'Methods for etching copper during the fabrication of integrated circuits'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015–2017Patents assigned to GLOBALFOUNDRIES INC (3)· patent assignee history
2015Patents assigned to INTERMOLECULAR INC (1)· patent assignee history
2015–2017Based in Dresden, DE· patent location history
2017Patents assigned to WILLEKE REINER (1)· patent assignee history
2017Patents assigned to ZENNER SÖREN (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GLOBALFOUNDRIES INC32015–2017
INTERMOLECULAR INC12015
WILLEKE REINERself12017
ZENNER SÖREN12017
Locations
LocationPatentsSpan
Dresden, DE32015–2017