Inventor
Chih-Wei Tsai
Inventor
Hsinchu, TW
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing13%
G11CStatic stores11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
G02BOptical elements, systems or apparatus5%
G06KGraphical data reading5%
H01LSemiconductor devices5%
H05KPrinted circuits5%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering3%
C03CChemical composition of glasses, glazes or vitreous enamels3%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds3%
PatentTitleYear
10,861,549Ternary content addressable memory unit capable of reducing charge sharing effect202010,762,951Static random access memory device with keeper circuit202010,640,635Resin composition and application thereof202010,429,206Counting device and pedometer device201910,020,049Six-transistor static random access memory cell and operation method thereof20189,507,658'Data reading method, memory storage device and memory controlling circuit unit'20169,485,407'Method of capturing images and obtaining information of the images'20169,449,209'3D-structured pattern reading system'20169,430,691'Fingerprint reading system'20169,330,044'High-speed data transmission interface circuit and design method of the same'20169,263,300'Etch back processes of bonding material for the manufacture of through-glass vias'20169,052,451'Liquid lens package structure'20158,332,607'Non-volatile memory storage device and operation method thereof'20128,220,144'Method for improving an Electromagnetic bandgap structure'20128,166,228'Non-volatile memory system and method for reading and storing sub-data during partially overlapping periods'20127,957,141'Heat-dissipating mechanism for use with memory module'20117,880,094'Differential signal layout printed circuit board'20117,791,881'Heat-dissipating mechanism for use with memory module'20107,235,989'Electrical test device having isolation slot'20076,927,480'Multi-chip package with electrical interconnection'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2007Patents assigned to ADVANCED SEMICONDUCTOR ENG (2)· patent assignee history
2005–2020Based in Tainan, TW· patent location history
2010–2012Patents assigned to ASUSTEK COMP INC (4)· patent assignee history
2010–2016Based in Taipei, TW· patent location history
2012Patents assigned to CHENG CHUANG (2)· patent assignee history
2012–2020Based in Hsinchu, TW· patent location history
2016Patents assigned to LUSTROUS ELECTRO-OPTIC CO LTD (2)· patent assignee history
2016Based in New Taipei, TW· patent location history
2016Based in Hsinchu County, TW· patent location history
2018–2020Patents assigned to UNITED MICROELECTRONICS CORP (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ASUSTEK COMP INC | 4 | 2010–2012 |
| UNITED MICROELECTRONICS CORP | 3 | 2018–2020 |
| ADVANCED SEMICONDUCTOR ENG | 2 | 2005–2007 |
| CHENG CHUANG | 2 | 2012 |
| LUSTROUS ELECTRO-OPTIC CO LTD | 2 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 9 | 2012–2020 |
| Taipei, TW | 5 | 2010–2016 |
| Tainan, TW | 2 | 2005–2020 |
| New Taipei, TW | 2 | 2016 |
| Hsinchu County, TW | 1 | 2016 |