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Inventor

Chi-Yu Wang

Inventor
Kaohsiung, TW

Overview

3→
Patents
2006–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
10,763,234Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer20209,773,753'Semiconductor devices and methods of manufacturing the same'20177,071,544'Wafer level assembly package'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2020Patents assigned to ADVANCED SEMICONDUCTOR ENG (3)· patent assignee history
2006–2020Based in Kaohsiung, TW· patent location history
2020Patents assigned to ADVANCED SEMICOMDUCTOR ENG INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED SEMICONDUCTOR ENG32006–2020
ADVANCED SEMICOMDUCTOR ENG INC12020
Locations
LocationPatentsSpan
Kaohsiung, TW32006–2020