Inventor
Shou-Jui Hsiang
Inventor
Taoyuan, TW
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits14%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds11%
C09DCoating compositions, e.g. paints, varnishes or lacquers11%
C08LCompositions of macromolecular compounds9%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
C08JWorking-up7%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients7%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%
C01BNon-metallic elements5%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds5%
PatentTitleYear
11,051,009Video processing methods and apparatuses for processing video data coded in large size coding units202111,019,338Methods and apparatuses of video encoding or decoding with adaptive quantization of video data202110,928,730Photosensitive resin composition, and polymer film made therefrom202110,894,882Low dielectric resin composition, film and circuit board using the same202110,875,984Inorganic shell, resin composition, and method for making inorganic shell202010,844,174Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same202010,822,522Modified polyimide compound, resin composition and polyimide film202010,428,238Resin composition, polyimide film and method for manufacturing polyimide film201910,423,069Water soluble photosensitive resin composition and film using same201910,329,368Photosensitive resin composition, and film and printed circuit board using same20199,593,207'Polyamic acid, polyimide, and method for manufacturing graphite sheet'20178,765,258'Cover film'20148,536,460'Composite double-sided copper foil substrates and flexible printed circuit board structures using the same'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2014Patents assigned to ASIA ELECTRONIC MATERIAL CO (2)· patent assignee history
2013–2014Patents assigned to HSIANG SHOU-JUI (2)· patent assignee history
2013–2014Patents assigned to LEE CHIEN-HUI (2)· patent assignee history
2013–2014Patents assigned to LIN CHIH-MING (2)· patent assignee history
2013–2021Based in Hsinchu, TW· patent location history
2017–2021Based in Taoyuan, TW· patent location history
2019–2021Patents assigned to ZHEN DING TECH CO LTD (8)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ZHEN DING TECH CO LTD | 8 | 2019–2021 |
| ASIA ELECTRONIC MATERIAL CO | 2 | 2013–2014 |
| HSIANG SHOU-JUIself | 2 | 2013–2014 |
| LEE CHIEN-HUI | 2 | 2013–2014 |
| LIN CHIH-MING | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taoyuan, TW | 9 | 2017–2021 |
| Hsinchu, TW | 4 | 2013–2021 |