Inventor
Muthiah Venkateswaran
Inventor
Richardson, TX, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H05KPrinted circuits18%
Y02PClimate change mitigation technologies in the production or processing of goods18%
Y10TTechnical subjects covered by former us classification18%
PatentTitleYear
7,135,765'Semiconductor device package and method of making the same'20067,084,011'Forming a chip package having a no-flow underfill'20066,888,255'Built-up bump pad structure and method for same'20056,849,944'Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad'20056,780,673'Method of forming a semiconductor device package using a plate layer surrounding contact pads'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2006Patents assigned to TEXAS INSTRUMENTS INC (5)· patent assignee history
2004–2006Based in Richardson, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 5 | 2004–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Richardson, Texas, US | 5 | 2004–2006 |