Inventor

Paul Ackmann

Inventor
Gansevoort, NY, US

Overview

34→
Patents
1985–2021
Patent span
Physics
Primary field (CPC G)

Patents· 34 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H01LSemiconductor devices12%
G06FElectric digital data processing10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y02PClimate change mitigation technologies in the production or processing of goods7%
H10DInorganic electric semiconductor devices6%
G01RMeasuring electric variables2%
G05BControl or regulating systems in general2%
G01NInvestigating or analysing materials by determining their chemical or physical properties1%
PatentTitleYear
10,923,388Gap fill void and connection structures202110,816,483Double pass diluted ultraviolet reticle inspection202010,401,724Pellicle replacement in EUV mask flow201910,002,827Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device20189,864,831'Metrology pattern layout and method of use thereof'20189,817,940'Method wherein test cells and dummy cells are included into a layout of an integrated circuit'20179,817,927'Hard mask etch and dielectric etch aware overlap for via and metal layers'20179,798,238'Cross technology reticle (CTR) or multi-layer reticle (MLR) CDU, registration, and overlay techniques'20179,791,772'Monitoring pattern for devices'20179,672,313'Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device'20179,672,312'Method wherein test cells and dummy cells are included into a layout of an integrated circuit'20179,658,531'Semiconductor device resolution enhancement by etching multiple sides of a mask'20179,645,486'Multiple threshold convergent OPC model'20179,535,319'Reticle, system comprising a plurality of reticles and method for the formation thereof'20179,500,945'Pattern classification based proximity corrections for reticle fabrication'20169,384,318'Mask error compensation by optical modeling calibration'20169,368,453'Overlay mark dependent dummy fill to mitigate gate height variation'20169,341,961'Cross technology reticle (CTR) or multi-layer reticle (MLR) CDU, registration, and overlay techniques'20169,323,882'Metrology pattern layout and method of use thereof'20169,252,061'Overlay mark dependent dummy fill to mitigate gate height variation'20169,250,538'Efficient optical proximity correction repair flow method and apparatus'20169,236,301'Customized alleviation of stresses generated by through-substrate via(S)'20169,136,223'Forming alignment mark and resulting mark'20159,029,855'Layout for reticle and wafer scanning electron microscope registration or overlay measurements'20158,907,496'Circuit structures and methods of fabrication with enhanced contact via electrical connection'20148,895,211'Semiconductor device resolution enhancement by etching multiple sides of a mask'20148,010,915'Grid-based fragmentation for optical proximity correction in photolithography mask applications'20116,405,144'Method and apparatus for programmed latency for improving wafer-to-wafer uniformity'20026,271,602'Method for reducing the susceptibility to chemical-mechanical polishing damage of an alignment mark formed in a semiconductor substrate'20016,207,966'Mark protection with transparent film'20016,178,256'Removal of reticle effect on critical dimension by reticle rotation'20015,757,673'Automated data management system for analysis and control of photolithography stepper performance'19985,586,059'Automated data management system for analysis and control of photolithography stepper performance'19964,508,815'Recessed metallization'1985

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1985Based in Lewisville, TX, US· patent location history
1996–2002Patents assigned to ADVANCED MICRO DEVICES INC (6)· patent assignee history
1996–2002Based in Buda, TX, US· patent location history
2011–2021Patents assigned to GLOBALFOUNDRIES INC (22)· patent assignee history
2011Based in Lakeway, TX, US· patent location history
2014–2021Based in Gansevoort, NY, US· patent location history
2015–2017Patents assigned to GLOBALFOUNDRIES SG PTE LTD (5)· patent assignee history
2015–2016Patents assigned to ACKMANN PAUL (2)· patent assignee history
2015–2016Patents assigned to NING GUO XIANG (2)· patent assignee history
2017Based in Ganesvoort, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GLOBALFOUNDRIES INC222011–2021
ADVANCED MICRO DEVICES INC61996–2002
GLOBALFOUNDRIES SG PTE LTD52015–2017
ACKMANN PAULself22015–2016
NING GUO XIANG22015–2016
Locations
LocationPatentsSpan
Gansevoort, New York, US252014–2021
Buda, Texas, US61996–2002
Ganesvoort, New York, US12017
Lakeway, Texas, US12011
Lewisville, Texas, US11985