Inventor
Feng Chen
Inventor
Milpitas, CA, US
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H01LSemiconductor devices7%
B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling2%
B23KSoldering or unsoldering2%
B23PMetal-working not otherwise provided for2%
C21DModifying the physical structure of ferrous metals2%
F16LPipes2%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
PatentTitleYear
10,907,752Pipe body, pipe and method of making pipe20219,673,146'Low temperature tungsten film deposition for small critical dimension contacts and interconnects'20179,236,297'Low tempature tungsten film deposition for small critical dimension contacts and interconnects'20169,034,760'Methods of forming tensile tungsten films and compressive tungsten films'20158,975,184'Methods of improving tungsten contact resistance in small critical dimension features'20158,853,080'Method for depositing tungsten film with low roughness and low resistivity'20148,623,733'Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects'20148,551,885'Method for reducing tungsten roughness and improving reflectivity'20138,409,987'Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics'20138,329,576'Method for improving uniformity and adhesion of low resistivity tungsten film'20128,058,170'Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics'20117,772,114'Method for improving uniformity and adhesion of low resistivity tungsten film'20107,611,969'Generation and applications of negative dielectric constant materials'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009Based in Houston, TX, US· patent location history
2010–2017Patents assigned to NOVELLUS SYSTEMS INC (11)· patent assignee history
2010–2016Based in Milpitas, CA, US· patent location history
2011–2015Patents assigned to CHEN FENG (7)· patent assignee history
2011–2014Patents assigned to HUMAYUN RAASHINA (5)· patent assignee history
2011–2013Patents assigned to CHAN LANA HIULUI (3)· patent assignee history
2011–2014Patents assigned to CHANDRASHEKAR ANAND (3)· patent assignee history
2011–2013Based in Sunnyvale, CA, US· patent location history
2015–2017Based in San Jose, CA, US· patent location history
2021Based in Zhejiang, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NOVELLUS SYSTEMS INC | 11 | 2010–2017 |
| CHEN FENGself | 7 | 2011–2015 |
| HUMAYUN RAASHINA | 5 | 2011–2014 |
| CHAN LANA HIULUI | 3 | 2011–2013 |
| CHANDRASHEKAR ANAND | 3 | 2011–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Milpitas, California, US | 7 | 2010–2016 |
| San Jose, California, US | 2 | 2015–2017 |
| Sunnyvale, California, US | 2 | 2011–2013 |
| Zhejiang, CN | 1 | 2021 |
| Houston, Texas, US | 1 | 2009 |