Inventor

Kazuo Kondo

Inventor

Aichi, JP

Overview

93→

Patents

1979–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 93 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary

Y10TTechnical subjects covered by former us classification14%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%

C03CChemical composition of glasses, glazes or vitreous enamels8%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%

H05KPrinted circuits7%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%

C04BLime, magnesia5%

B29CShaping or joining of plastics3%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts2%

C08LCompositions of macromolecular compounds2%

PatentTitleYear

10,632,669Helical layer structure and manufacturing method of helical layer structure2020 9,512,534'Copper filling-up method'2016 8,273,232'Copper filling-up method'2012 8,056,912'Multi-link suspension device and method for suspending wheels'2011 8,011,679'Multi-link suspension device and method for suspending wheels'2011 7,389,998'Vehicle steering system'2008 7,237,779'Vehicle height adjusting apparatus'2007 6,631,349'Speech recognition method and system'2003 6,511,607'Method of making an electrical connecting member'2003 6,411,929'Speech recognition method and system'2002 6,015,081'Electrical connections using deforming compression'2000 5,876,451'Medical device and method for producing the same'1999 5,860,818'Electrical connecting member'1999 5,736,260'Multilayer packaging film'1998 5,723,010'Medical device and method for producing the same'1998 5,635,301'Multilayered glass substrate'1997 5,614,315'Heat-shrinkable multi-layer polyolefin films'1997 5,600,884'Method of manufacturing electrical connecting member'1997 5,462,777'Wrapping multilayer film'1995 5,407,871'Glass-ceramic composite'1995 5,405,562'Process of making a coated substrate having closed porosity'1995 5,379,515'Process for preparing electrical connecting member'1995 5,362,551'Ceramic substrate'1994 5,356,841'Glass-ceramic composite'1994 5,352,482'Process for making a high heat-conductive, thick film multi-layered circuit board'1994 5,323,535'Electrical connecting member and method of manufacturing the same'1994 5,318,829'Heat shrinkable laminate film'1994 5,318,744'Process for producing ceramic sintered body having metallized via hole'1994 5,306,550'Biodegradable composition and shaped article obtained therefrom'1994 5,296,276'Seamless endless belt'1994 5,271,976'Biaxially stretched multilayer film and process for manufacturing same'1993 5,261,950'Composition for metalizing ceramics'1993 5,175,130'Low-temperature baked substrate'1992 5,169,714'Heat-shrinkable polypropylene film with improved printability'1992 5,163,099'Imaging apparatus having a detector for determining the presence of contrasting portions in a viewed object'1992 5,154,864'Process of producing biodegradable sheet formed of cellulose and chitosan'1992 5,145,552'Process for preparing electrical connecting member'1992 5,135,606'Process for preparing electrical connecting member'1992 5,122,930'High heat-conductive, thick film multi-layered circuit board'1992 5,120,473'Metallizing composition for use with ceramics'1992 5,108,803'Thermally shrinkable film having a liquid detecting function and a package using the same'1992 5,089,444'Method of producing colored crystallized glass'1992 5,062,798'SiC based artificial dental implant'1991 5,024,973'Crystallized glass tooth crown material'1991 5,011,734'Ceramic substrate'1991 5,011,530'Metallizing composition for use with ceramics'1991 5,007,932'Artificial bone joint'1991 5,006,167'Metallizing composition'1991 5,003,131'Connection structure between ceramic body and outer terminal'1991 5,001,016'Heat shrinkable composite film and packaging method using same'1991 4,963,187'Metallizing paste for circuit board having low thermal expansion coefficient'1990 4,943,470'Ceramic substrate for electrical devices'1990 4,941,582'Hermetically sealed ceramic package'1990 4,923,722'Heat shrinkable composite film and packaging method using same'1990 4,871,608'High-density wiring multilayered substrate'1989 4,861,625'Method of manufacturing a thermal printing head having a partially-glazed ceramic substrate'1989 4,858,030'Reproducing apparatus of a video disc player'1989 4,839,313'Glaze compositions for ceramic substrates'1989 4,837,408'High density multilayer wiring board and the manufacturing thereof'1989 4,810,528'Process for producing multilayer circuit board'1989 4,801,067'Method of connecting metal conductor to ceramic substrate'1989 4,780,572'Device for mounting semiconductors'1988 4,777,095'Chilled beef packaging film'1988 4,753,318'Engine noise control device for use in automobiles or the like'1988 4,746,578'Glaze compositions for ceramic substrates'1988 4,731,214'Process for preparing a thermally shrinkable multilayer film'1988 4,726,444'Sound wave control device'1988 4,709,714'Apparatus for exposing fibrous reinforcements of fiber reinforced resin body'1987 4,695,491'Heat-shrinkable composite packaging film'1987 4,689,579'Analog integrated circuit'1987 4,687,615'Method of producing biaxially oriented tubular polyetheretherketone films'1987 4,685,919'Artificial joint'1987 4,649,070'Substrate for an integrated circuit'1987 4,634,634'Glaze ceramic base'1987 4,626,392'Process for producing ceramic body for surgical implantation'1986 4,625,322'Charge coupled device provided with automatic bias-voltage setting means'1986 4,605,091'Sound insulating apparatus'1986 4,595,059'Method of providing a conductor pipe to an opening portion of a well'1986 4,540,671'Glass-ceramic product'1985 4,523,711'Method for bonding silver-based contact'1985 4,483,678'Dental implant for attachment of artificial tooth'1984 4,456,885'Filter circuit suitable for being fabricated into integrated circuit'1984 4,451,746'Non-linear emphasis circuit'1984 4,376,168'Phosphate of calcium ceramics'1983 4,374,942'Powder having a negative coefficient of linear thermal expansion and a composition containing the same'1983 4,352,889'Tin oxide, titanium oxide and/or zirconium oxide coated .beta.-eucryptite particles having a negative coefficient of linear thermal expansion and sealing compositions containing said particles'1982 4,310,598'Coated glass powder having a negative coefficient of linear thermal expansion and a composition containing the same'1982 4,309,485'Enameled steel plate'1982 4,308,064'Phosphate of calcium ceramics'1981 4,307,951'Zoom lens system for camera'1981 4,160,491'Perlite sound absorbing plate and sound insulating wall composed of the same'1979 4,156,709'Process for preparing a polypropylene film for shrink packaging'1979 4,135,038'Seal structure of ceramics and low expansion metallic material'1979

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1979–1997Patents assigned to NGK SPARK PLUG CO (40)· patent assignee history

1979–1998Patents assigned to OKURA INDUSTRIAL CO LTD (16)· patent assignee history

1979–1998Based in Marugame, JP· patent location history

1979–1995Based in Nagoya, JP· patent location history

1979–1988Based in Yokohama, JP· patent location history

1982–2020Based in Aichi, JP· patent location history

1984–2003Patents assigned to HITACHI LTD (7)· patent assignee history

1992–2003Patents assigned to CANON KK (8)· patent assignee history

1992–2003Patents assigned to SUMITOMO METAL IND (7)· patent assignee history

1992–2003Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
NGK SPARK PLUG CO	40	1979–1997
OKURA INDUSTRIAL CO LTD	16	1979–1998
CANON KK	8	1992–2003
HITACHI LTD	7	1984–2003
SUMITOMO METAL IND	7	1992–2003

Locations

Location	Patents	Span
Aichi, JP	31	1982–2020
Marugame, JP	16	1979–1998
Nagoya, JP	13	1979–1995
Tokyo, JP	8	1992–2003
Yokohama, JP	7	1979–1988