Inventor

Takahiro Daikoku

Inventor

Ushiku, JP

Overview

60→

Patents

1979–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 60 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application13%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%

F25BRefrigeration machines, plants or systems5%

H05KPrinted circuits5%

H01FMagnets5%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact4%

B01DSeparation3%

B41JTypewriters3%

B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling2%

PatentTitleYear

11,044,838Railway equipment inspecting and measuring apparatus, and railway equipment inspecting and measuring method2021 10,532,401Liquid-cooling cold plate and method for manufacturing same2020 10,421,299Sheet supplying apparatus and printing apparatus2019 7,518,233'Sealing structure for multi-chip module'2009 6,890,799'Device for sealing and cooling multi-chip modules'2005 6,711,017'Cooling apparatus for electronic unit'2004 6,632,780'Highly thermal conductive grease composition and cooling device using the same'2003 6,528,878'Device for sealing and cooling multi-chip modules'2003 6,351,384'Device and method for cooling multi-chip modules'2002 6,281,575'Multi-chip module'2001 5,934,368'Air-cooled electronic apparatus with condensation prevention'1999 5,818,694'Cooling apparatus for electronic devices'1998 5,774,334'Low thermal resistant, fluid-cooled semiconductor module'1998 5,751,062'Cooling device of multi-chip module'1998 RE035721'Cooling device of semiconductor chips'1998 5,705,850'Semiconductor module'1998 5,705,854'Cooling apparatus for electronic device'1998 5,689,572'Method of actively controlling noise, and apparatus thereof'1997 5,595,240'Cooling apparatus of electronic devices'1997 5,592,363'Electronic apparatus'1997 5,558,493'Forced air cooling apparatus having blower and air current regulating plate that reduces eddy air current at inlet of blower'1996 5,515,912'Cooling apparatus of electronic devices'1996 5,504,651'Cooling apparatus for electronic equipment'1996 5,365,400'Heat sinks and semiconductor cooling device using the heat sinks'1994 5,349,831'Apparatus for cooling heat generating members'1994 5,345,107'Cooling apparatus for electronic device'1994 5,276,586'Bonding structure of thermal conductive members for a multi-chip module'1994 5,270,572'Liquid impingement cooling module for semiconductor devices'1993 5,133,403'Cooling arrangement for semiconductor devices and method of making the same'1992 5,126,829'Cooling apparatus for electronic device'1992 5,089,936'Semiconductor module'1992 5,077,601'Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system'1991 5,058,389'Fluid temperature control system and computer system using same'1991 5,047,837'Semiconductor device with heat transfer cap'1991 4,956,043'Dry etching apparatus'1990 4,897,762'Cooling system and method for electronic circuit devices'1990 4,872,606'Sealed structure and production method thereof'1989 4,823,863'Thermal conduction device'1989 4,770,242'Cooling device of semiconductor chips'1988 4,678,029'Evaporating heat transfer wall'1987 4,672,392'Thermal head for thermal printer'1987 4,649,990'Heat-conducting cooling module'1987 4,606,405'Heat transfer wall'1986 4,602,681'Heat transfer surface with multiple layers'1986 4,587,399'Thermal head'1986 4,585,055'Liquid film evaporation type heat exchanger'1986 4,561,497'Heat transfer surface and manufacturing method for same'1985 4,558,395'Cooling module for integrated circuit chips'1985 4,532,770'Magnetic refrigerator'1985 4,520,866'Falling film evaporation type heat exchanger'1985 4,457,135'Magnetic refrigerating apparatus'1984 4,431,980'Electrical apparatus winding'1984 4,363,012'Winding structure for static electrical induction apparatus'1982 4,363,013'Winding structure for static electrical induction apparatus'1982 4,298,825'Magnetron device'1981 4,245,206'Winding structure for static electrical induction apparatus'1981 4,207,550'Winding structure of electric devices'1980 4,195,688'Heat-transfer wall for condensation and method of manufacturing the same'1980 4,194,384'Method of manufacturing heat-transfer wall for vapor condensation'1980 4,166,498'Vapor-condensing, heat-transfer wall'1979

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1979–2009Patents assigned to HITACHI LTD (55)· patent assignee history

1979–1987Patents assigned to HITACHI CABLE (6)· patent assignee history

1979–1988Based in Ibaraki, JP· patent location history

1980–1998Based in Ushikumachi, JP· patent location history

1987–2009Based in Ushiku, JP· patent location history

1996Patents assigned to HITACHI CHEMICAL CO LTD (1)· patent assignee history

2004–2020Patents assigned to HITACHI INT ELECTRIC INC (2)· patent assignee history

2019Patents assigned to CANON KK (1)· patent assignee history

2019Based in Inagi, JP· patent location history

2020–2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	55	1979–2009
HITACHI CABLE	6	1979–1987
HITACHI INT ELECTRIC INC	2	2004–2020
CANON KK	1	2019
HITACHI CHEMICAL CO LTD	1	1996

Locations

Location	Patents	Span
Ushiku, JP	33	1987–2009
Ibaraki, JP	18	1979–1988
Ushikumachi, JP	4	1980–1998
Tokyo, JP	2	2020–2021
Inagi, JP	1	2019