Inventor
Lianjun Liu
Inventor
Chandler, AZ, US
Overview
Patents· 92 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices16%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems11%
G01RMeasuring electric variables10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
H01LSemiconductor devices6%
H10DInorganic electric semiconductor devices6%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
H01HElectric switches4%
H10NElectric solid-state devices not otherwise provided for4%
PatentTitleYear
10,827,648Cabinet liquid cooling system and cabinet202010,591,508MEMS inertial sensor and forming method therefor202010,546,779Through substrate via (TSV) and method therefor202010,364,140Integrating diverse sensors in a single semiconductor device201910,302,514Pressure sensor having a multiple wheatstone bridge configuration of sense elements201910,215,653Signal interface circuit and pressure sensor system including same201910,178,801Cabinet liquid cooling system and cabinet201910,157,792Through substrate via (TSV) and method therefor201810,145,907Magnetic field sensor with permanent magnet biasing20189,958,471MEMS inertial sensor and forming method therefor20189,960,081Method for selective etching using dry film photoresist20189,933,496Magnetic field sensor with multiple axis sense capability20189,926,187'Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof'20189,897,667'Magnetic field sensor with permanent magnet biasing'20189,857,435'Corruption detection and smart reset of ferromagnetic structures in magnetic field sensors'20189,841,469'Magnetic field sensor with multiple sense layer magnetization orientations'20179,824,774'Magnetic field programming of electronic devices on a wafer'20179,790,085'Actively preventing charge induced leakage of semiconductor devices'20179,790,082'CMOS and pressure sensor integrated on a chip and fabrication method'20179,784,787'Electric field sensor, system, and method for programming electronic devices on a wafer'20179,766,301'Method for reset and stabilization control of a magnetic sensor'20179,739,842'Magnetic field sensor with skewed sense magnetization of sense layer'20179,720,051'Sensor package including a magnetic field sensor and a continuous coil structure for enabling z-axis self-test capability'20179,674,619'MEMS microphone and forming method therefor'20179,664,755'Magnetic field sensor with structure for reconditioning magnetic polarization of flux guides'20179,633,952'Substrate structure and method for manufacturing same'20179,606,144'Probe card and method for testing magnetic sensors'20179,607,911'Optical programming of electronic devices on a wafer'20179,588,211'Apparatus and method for resetting a Z-axis sensor flux guide'20179,469,523'Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof'20169,448,251'Integrated inertial sensor and pressure sensor, and forming method therefor'20169,389,652'Optical disc drive installation mechanism, and outer frame for installing optical disc drive'20169,343,242'Method of making contact posts for a microelectromechanical device'20169,318,376'Through substrate via with diffused conductive component'20169,279,865'Method and structure for testing and calibrating three axis magnetic field sensing devices'20169,229,070'Apparatus and method for reset and stabilization control of a magnetic sensor'20169,073,746'MEMS pressure sensor and manufacturing method therefor'20159,073,745'MEMS pressure sensor and manufacturing method therefor'20159,061,885'Cavity based packaging for MEMS devices'20159,041,213'Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof'20159,034,679'Method for fabricating multiple types of MEMS devices'20159,035,671'Probe card and method for testing magnetic sensors'20159,018,029'Vent hole sealing in multiple die sensor device'20159,000,760'Apparatus and method for resetting a Z-axis sensor flux guide'20158,921,952'Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof'20148,922,205'Apparatus and method for reset and stabilization control of a magnetic sensor'20148,883,535'Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof'20148,736,145'Electromechanical transducer device and method of forming a electromechanical transducer device'20148,551,814'Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing'20138,513,042'Method of forming an electromechanical transducer device'20138,511,170'Pressure transducer having structure for monitoring surface charge'20138,461,657'Methods for forming a micro electro-mechanical device'20138,461,656'Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS)'20138,455,286'Method of making a micro-electro-mechanical-systems (MEMS) device'20138,445,978'Electromechanical transducer device and method of forming a electromechanical transducer device'20138,330,239'Shielding for a micro electro-mechanical device and method therefor'20128,158,492'MEMS microphone with cavity and method therefor'20128,148,793'Three dimensional integrated passive device and method of fabrication'20128,149,564'MEMS capacitive device and method of forming same'20128,138,062'Electrical coupling of wafer structures'20128,119,431'Method of forming a micro-electromechanical system (MEMS) having a gap stop'20127,961,063'Balun signal transformer and method of forming'20117,869,784'Radio frequency circuit with integrated on-chip radio frequency inductive signal coupler'20117,829,366'Microelectromechanical systems component and method of making same'20107,830,066'Micromechanical device with piezoelectric and electrostatic actuation and method therefor'20107,742,275'MEMS capacitor with conductively tethered moveable capacitor plate'20107,732,991'Self-poling piezoelectric MEMs device'20107,683,733'Balun transformer with improved harmonic suppression'20107,674,646'Three dimensional integrated passive device and method of fabrication'20107,663,196'Integrated passive device and method of fabrication'20107,630,693'Transmitter with improved power efficiency'20097,586,238'Control and testing of a micro electromechanical switch having a piezo element'20097,567,782'Re-configurable impedance matching and harmonic filter system'20097,556,978'Piezoelectric MEMS switches and methods of making'20097,479,785'Control and testing of a micro electromechanical switch'20097,462,335'Optical monitoring and control system and method for plasma reactors'20087,446,017'Methods and apparatus for RF shielding in vertically-integrated semiconductor devices'20087,439,606'Method for manufacturing a passive integrated matching network for power amplifiers'20087,418,251'Compact radio frequency harmonic filter using integrated passive device technology'20087,414,316'Methods and apparatus for thermal isolation in vertically-integrated semiconductor devices'20087,305,223'Radio frequency circuit with integrated on-chip radio frequency signal coupler'20077,276,420'Method of manufacturing a passive integrated matching network for power amplifiers'20077,141,989'Methods and apparatus for a MEMS varactor'20067,017,652'Method and apparatus for transferring heat from a substrate to a chuck'20067,018,553'Optical monitoring and control system and method for plasma reactors'20066,809,036'Dry silylation plasma etch process'20046,794,101'Micro-electro-mechanical device and method of making'20046,776,170'Method and apparatus for plasma cleaning of workpieces'20046,706,548'Method of making a micromechanical device'20046,225,140'CMOS compatable surface machined pressure sensor and method of fabricating the same'20015,705,428'Method for preventing titanium lifting during and after metal etching'19985,609,775'Dry etch process for titanium-tungsten films'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2001Based in Singapore, SG· patent location history
2004–2020Based in Chandler, AZ, US· patent location history
2004–2009Based in Gilbert, AZ, US· patent location history
2006–2019Patents assigned to FREESCALE SEMICONDUCTOR INC (57)· patent assignee history
2012–2018Patents assigned to LIU LIANJUN (33)· patent assignee history
2014–2017Patents assigned to EVERSPIN TECHNOLOGIES INC (8)· patent assignee history
2015–2020Patents assigned to MEMSEN ELECTRONICS INC (7)· patent assignee history
2015–2020Based in Tianjin, CN· patent location history
2016–2020Based in Shenzhen, CN· patent location history
2017–2020Patents assigned to NXP USA INC (20)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 57 | 2006–2019 |
| LIU LIANJUNself | 33 | 2012–2018 |
| NXP USA INC | 20 | 2017–2020 |
| EVERSPIN TECHNOLOGIES INC | 8 | 2014–2017 |
| MEMSEN ELECTRONICS INC | 7 | 2015–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 65 | 2004–2020 |
| Gilbert, AZ, US | 13 | 2004–2009 |
| Tianjin, CN | 7 | 2015–2020 |
| Shenzhen, CN | 3 | 2016–2020 |
| Singapore, SG | 3 | 1997–2001 |